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MSP432P411VIPZ bảng dữ liệu(PDF) 46 Page - Texas Instruments |
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MSP432P411VIPZ bảng dữ liệu(HTML) 46 Page - Texas Instruments |
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46 / 212 page ![]() 46 MSP432P4111, MSP432P4011, MSP432P411Y MSP432P401Y, MSP432P411V, MSP432P401V SLASEA0A – DECEMBER 2017 – REVISED FEBRUARY 2018 www.ti.com Submit Documentation Feedback Product Folder Links: MSP432P4111 MSP432P4011 MSP432P411Y MSP432P401Y MSP432P411V MSP432P401V Specifications Copyright © 2017–2018, Texas Instruments Incorporated 5.26 Timing and Switching Characteristics 5.26.1 Reset Timing Table 5-1 lists the latencies to recover from different types of resets. (1) See Section 6.8.1 for details on the various classes of resets on the device Table 5-1. Reset Recovery Latencies over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (1) PARAMETER MIN TYP MAX UNIT tSOFT Latency from release of soft reset to first CPU instruction fetch 5 MCLK cycles tHARD Latency from release of hard reset to release of soft reset 25 MCLK cycles tPOR Latency from release of device POR to release of hard reset 15 25 µs tCOLDPWR, 100nF Latency from a cold power-up condition to release of device POR, CVCORE = 100 nF 300 400 µs tCOLDPWR, 4.7µF Latency from a cold power-up condition to release of device POR, CVCORE = 4.7 µF 400 500 µs Table 5-2 lists the latencies to recover from an external reset applied on RSTn pin. (1) External reset is applied on RSTn pin, and the latency is measured from release of external reset to start of user application code. Table 5-2. External Reset Recovery Latencies(1) over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) PARAMETER TEST CONDITIONS MIN MAX UNIT tAM_RSTn External reset applied when device is in LDO-based or DC/DC-based active modes, MCLK = 1 to 48 MHz 4.5 ms tAMLF_RSTn, 128 kHz External reset applied when device is in low-frequency active modes, MCLK = 128 kHz 5 ms tAMLF_RSTn, 32 kHz External reset applied when device is in low-frequency active modes, MCLK = 32.768 kHz 6 ms tLPM0_RSTn External reset applied when device is in LDO-based or DC/DC-based LPM0 modes, MCLK = 1 to 48 MHz 4.5 ms tLPM0LF_RSTn, 128 kHz External reset applied when device is in low-frequency LPM0 modes, MCLK = 128 kHz 5 ms tLPM0LF_RSTn, 32 kHz External reset applied when device is in low-frequency LPM0 modes, MCLK = 32.768 kHz 6 ms tLPM3_LPM4_RSTn External reset applied when device is in LPM3 or LPM4 modes, MCLK = 24 or 48 MHz while entering LPM3 or LPM4 modes 4.5 ms tLPMx.5_RSTn External reset applied when device is in LPM3.5 or LPM4.5 modes 4.5 ms 5.26.2 Peripheral Register Access Timing Table 5-3 lists the latency involved when CPU performs read or write access to peripheral registers. (1) The bridge that connects CPU to peripherals runs at half of the speed of the CPU. (2) The maximum value depends on the previous opcode executing in the CPU pipeline and the status of the bus (idle or busy performing data access). Table 5-3. Peripheral Register Access Latency over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) PARAMETER MIN MAX UNIT treg_access Number of CPU clock cycles required for read or write access to peripheral registers 2(1) 5(2) MCLK cycles |
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