CS53L30 datasheet(66/67 Pages) CIRRUS

66 / 67 page

DS992F2

CS53L30

10.2 QFN Package

Figure 10-2. 32-Pin QFN Package Drawing 1

11 Thermal Characteristics

12 Ordering Information

Dim

Millimeters

Min

Nom

Max

A—

—

1.00

0.00

—

0.05

0.200.250.30

5.00 BSC

3.55

3.65

3.75

5.00 BSC

3.55

3.65

3.75

0.50 BSC

0.350.400.45

JEDEC #: MO–220

Controlling dimension is millimeters.

1. Dimensioning and tolerances per ASME Y 14.5M–1995.

2. Dimensioning lead width applies to the plated terminal and is measured between 0.20 and 0.25 mm from

the terminal tip.

Table 11-1. Thermal Characteristics

Parameters 1,2

1.Test printed circuit board assembly (PCBA) constructed in accordance with JEDEC standard JESD51–9. Two-signal, two-plane (2s2p) PCB used.

2.Test conducted with still air on a four-layer board in accordance with JEDEC standards, JESD51, JESD51–2A, and JESD51–8.

Symbol

Min

Typ

Max

Units

Junction-to-ambient thermal impedance

WLCSP

QFN

JA

—

°C/W

Junction-to-printed circuit board thermal impedance

WLCSP

QFN

JB

—

°C/W

Table 12-1. Ordering Information

Product

Description

Package

Pb Free

Grade

Temp Range

Container

Order #

CS53L30 Low-Power Quad-Channel

Microphone ADC with TDM Output

30-ball WLCSP

Yes

Commercial –10°C to +70°C Tape and reel CS53L30-CWZR

32-pin QFN

Yes

Commercial –10°C to +70°C Tape and reel CS53L30-CNZR

Tray

CS53L30-CNZ

Pin #1 Corner

Top View

Side View

Bottom View

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