TNETV2501INPGF datasheet(17/197 Pages) TI1

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Introduction

December 2002 − Revised November 2008

SPRS206K

2.2

Pin Assignments

2.2.1 Ball Grid Array (GZZ and ZZZ)

The TMS320VC5501 is offered in two 201-terminal ball grid array (BGA) packages, both of which include

25 thermal balls to improve thermal dissipation. Except for their Eco-Status (refer to Section 6.2, Packaging

Information), both packages are essentially the same. Figure 2−1 illustrates the ball locations for both BGA

packages. Table 2−1 lists the locations of the thermal balls and Table 2−2 lists the signal names and terminal

numbers.

NOTE:

Some TMX samples were shipped in the GGW package. For more information on the GGW

package, see the TMS320VC5502 and TMS320VC5501 Digital Signal Processors Silicon

Errata (literature number SPRZ020D or later).

Figure 2−1. 201-Terminal GZZ and ZZZ Ball Grid Array (Bottom View)

Table 2−1. 201-Terminal GZZ and ZZZ Ball Grid Array Thermal Ball Locations†

BALL NO.

G10

G11

H10

H11

J10

J11

K10

K11

L10

L11

† For best device thermal performance:

− An array of 25 land pads must be added on the top layer of the PCB where the package will be mounted.

− The PCB land pads should be the same diameter as the vias in the package substrate for optimal Board Level Reliability Temperature Cycle

performance.

− The land pads on the PCB should be connected together and to PCB through-holes. The PCB through-holes should in turn be connected

to the ground plane for heat dissipation.

− A solid internal plane is preferred for spreading the heat.

Refer to the MicroStar BGA

E Packaging Reference Guide (literature number SSYZ015) for guidance on PCB design, surface mount, and

reliability considerations.

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