MPC8569E datasheet(120/127 Pages) FREESCALE

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MPC8569E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 1

Thermal Management Information

Freescale Semiconductor

120

3.3

Thermal Management Information

This section provides thermal management information for the flip chip plastic ball grid array (FC-PBGA) package for

air-cooled applications. Proper thermal control design is primarily dependent on the system-level design—the heat sink, airflow,

and thermal interface material.

The recommended attachment method to the heat sink is illustrated in the following figure. The heat sink must be attached to

the printed-circuit board with the spring force centered over the package. This spring force should not exceed 10 pounds force

(45 Newtons).

Figure 73. Package Exploded Cross-Sectional View

The system board designer can choose among several types of commercially-available heat sinks to determine the appropriate

one to place on the device. Ultimately, the final selection of an appropriate heat sink depends on factors such as thermal

performance at a given air velocity, spatial volume, mass, attachment method, assembly, and cost.

3.3.1

Internal Package Conduction Resistance

For the package, the intrinsic internal conduction thermal resistance paths are as follows:

•

The die junction-to-case thermal resistance

•

The die junction-to-board thermal resistance

Adhesive or

Heat Sink

FC-PBGA Package

Heat Sink

Clip

Printed-Circuit Board

Thermal Interface Material

Die

Die Lid

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