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MPL460AT-I/4LB bảng dữ liệu(PDF) 8 Page - Microchip Technology |
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MPL460AT-I/4LB bảng dữ liệu(HTML) 8 Page - Microchip Technology |
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8 / 48 page ![]() PL460 Signal Description Data Sheet © 2020-2023 Microchip Technology Inc. and its subsidiaries DS60001666D - 8 Table 3-1. Signal Description List (continued) Signal Name Function Type Active Level Voltage Reference Comments EMIT[2:3] PLC Tri-state Transmission ports Output — VDDIO — TXRX1 Analog Front-End Transmission/Reception for the auxiliary transmission branch. This digital output is used to modify external coupling behavior in Transmission/Reception Output — VDDIO — Input/Output STBY Enable Sleep mode of the modem Input High VDDIO (Note 16) EXTIN Indication of pending events Output Low VDDIO — TXEN Transmission enabled Input High VDDIO — Thermal Monitor THEN Enable Thermal Monitor functionality Input High VDDIO — NTHW0 Indication of the first thermal warning Output — VDDIO — THW1 Indication of the second thermal warning Output — VDDIO — G1 General Purpose Input Input High VDDIO — Serial Peripheral Interface - SPI CS SPI Chip Select Input Low VDDIO Internal pull up (Note 17) SCK SPI Clock signal Input — VDDIO Internal pull up (Note 17) MOSI SPI Host Out Client In Input — VDDIO Internal pull up (Note 17) MISO SPI Host In Client Out Output — VDDIO — Notes: 1. Connecting two 100 nF decoupling multilayer ceramic capacitors (MLCC) to the VDDIO and VDDIN pins is recommended. In addition, for correct PLC transmission using the auxiliary branch, placing one 4.7 μF decoupling multilayer ceramic capacitor (MLCC) as close as possible to VDDIO pins, D1 and D3, is strongly recommended. 2. Placing a 100 nF decoupling multilayer ceramic capacitor (MLCC) in the VDDIN_AN pins is recommended. 3. Placing 100 nF plus 2.2 μF decoupling multilayer ceramic capacitors (MLCC) in each pair of VDDCORE pins (H5-J5 and C1-C2) is recommended. 4. Placing 100 nF plus 4.7 μF decoupling multilayer ceramic capacitors (MLCC) in the VDDPLL pin is recommended. 5. A 100 nF multilayer ceramic capacitor (MLCC) is required between the VREGP and PVDDAMP pads for decoupling and stabilization purposes. 6. A 100 nF multilayer ceramic capacitor (MLCC) is required between the VREGN and GNDAMP pads for decoupling and stabilization purposes. 7. Placing one 100 uF aluminum Low-ESR 25V capacitor and three 100 nF 25V multilayer ceramic capacitors (MLCC) in the PVDDAMP pins is recommended. 8. The PLC-protocol firmwares provided by Microchip are configured by default for a power supply of the PLC driver amplifier of 12V. 9. Placing a 100 nF decoupling multilayer ceramic capacitor (MLCC) in the VDDAMP pins is recommended. 10. Separate pins are provided for GND, AGND, PGND, and GNDAMP grounds. Taking these layout considerations into account to reduce interference is recommended. It is recommended to connect ground pins as short as possible to the system ground plane. For more details about EMC Considerations, refer to AVR040 Application Note. |
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