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MPL460AT-I/4LB bảng dữ liệu(PDF) 8 Page - Microchip Technology

tên linh kiện MPL460AT-I/4LB
Giải thích chi tiết về linh kiện  programmable modem designed for narrow-band Power Line Communication (PLC)
PDF  48 Pages
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nhà sản xuất  MICROCHIP [Microchip Technology]
Trang chủ  http://www.microchip.com
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MPL460AT-I/4LB bảng dữ liệu(HTML) 8 Page - Microchip Technology

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PL460
Signal Description
 Data Sheet
© 2020-2023 Microchip Technology Inc. and its subsidiaries
DS60001666D - 8
Table 3-1. Signal Description List (continued)
Signal Name
Function
Type
Active
Level
Voltage
Reference
Comments
EMIT[2:3]
PLC Tri-state Transmission ports
Output
—
VDDIO
—
TXRX1
Analog Front-End Transmission/Reception
for the auxiliary transmission branch.
This
digital
output
is
used
to
modify external coupling behavior in
Transmission/Reception
Output
—
VDDIO
—
Input/Output
STBY
Enable Sleep mode of the modem
Input
High
VDDIO
(Note 16)
EXTIN
Indication of pending events
Output
Low
VDDIO
—
TXEN
Transmission enabled
Input
High
VDDIO
—
Thermal Monitor
THEN
Enable Thermal Monitor functionality
Input
High
VDDIO
—
NTHW0
Indication of the first thermal warning
Output
—
VDDIO
—
THW1
Indication of the second thermal warning
Output
—
VDDIO
—
G1
General Purpose Input
Input
High
VDDIO
—
Serial Peripheral Interface - SPI
CS
SPI Chip Select
Input
Low
VDDIO
Internal pull up (Note 17)
SCK
SPI Clock signal
Input
—
VDDIO
Internal pull up (Note 17)
MOSI
SPI Host Out Client In
Input
—
VDDIO
Internal pull up (Note 17)
MISO
SPI Host In Client Out
Output
—
VDDIO
—
Notes: 
1. Connecting two 100 nF decoupling multilayer ceramic capacitors (MLCC) to the VDDIO and
VDDIN pins is recommended. In addition, for correct PLC transmission using the auxiliary
branch, placing one 4.7 μF decoupling multilayer ceramic capacitor (MLCC) as close as possible
to VDDIO pins, D1 and D3, is strongly recommended.
2. Placing a 100 nF decoupling multilayer ceramic capacitor (MLCC) in the VDDIN_AN pins is
recommended.
3. Placing 100 nF plus 2.2 μF decoupling multilayer ceramic capacitors (MLCC) in each pair of
VDDCORE pins (H5-J5 and C1-C2) is recommended.
4. Placing 100 nF plus 4.7 μF decoupling multilayer ceramic capacitors (MLCC) in the VDDPLL pin is
recommended.
5. A 100 nF multilayer ceramic capacitor (MLCC) is required between the VREGP and PVDDAMP
pads for decoupling and stabilization purposes.
6. A 100 nF multilayer ceramic capacitor (MLCC) is required between the VREGN and GNDAMP pads
for decoupling and stabilization purposes.
7. Placing one 100 uF aluminum Low-ESR 25V capacitor and three 100 nF 25V multilayer ceramic
capacitors (MLCC) in the PVDDAMP pins is recommended.
8. The PLC-protocol firmwares provided by Microchip are configured by default for a power supply
of the PLC driver amplifier of 12V.
9. Placing a 100 nF decoupling multilayer ceramic capacitor (MLCC) in the VDDAMP pins is
recommended.
10. Separate pins are provided for GND, AGND, PGND, and GNDAMP grounds. Taking these layout
considerations into account to reduce interference is recommended. It is recommended to
connect ground pins as short as possible to the system ground plane. For more details about
EMC Considerations, refer to AVR040 Application Note.



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