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MPL460AT-I/4LB bảng dữ liệu(PDF) 41 Page - Microchip Technology |
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MPL460AT-I/4LB bảng dữ liệu(HTML) 41 Page - Microchip Technology |
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41 / 48 page ![]() PL460 Mechanical Characteristics Data Sheet © 2020-2023 Microchip Technology Inc. and its subsidiaries DS60001666D - 41 For the most current package drawings, please see the Microchip Packaging Specification located at http://www.microchip.com/packaging Note: © 2020 Microchip Technology Inc. REF: Reference Dimension, usually without tolerance, for information purposes only. BSC: Basic Dimension. Theoretically exact value shown without tolerances. Notes: 1. 2. Pin 1 visual index feature may vary, but must be located within the hatched area. Dimensioning and tolerancing per ASME Y14.5M Sheet 2 of 2 Number of Terminals Overall Height Ball Diameter Overall Width Ball Array Width Substrate Thickness Pitch Ball Height Units Dimension Limits A1 A b E2 A3 e E N 1.00 BSC 0.26 REF 0.38 – 0.27 0.40 8.00 BSC – 0.32 10.00 BSC MILLIMETERS MIN NOM 81 0.48 1.20 0.37 MAX Overall Length Ball Array Length D D2 10.00 BSC 8.00 BSC Mold Thickness A2 0.53 REF 81-Ball Thin Fine-Pitch Ball Grid Array Package (4LB) - 10x10x1.2 mm Body [TFBGA] Microchip Technology Drawing C04-21526 Rev A |
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