MPL460AT-ISLASH4LB datasheet(34/48 Pages) MICROCHIP

34 / 48 page

PL460

Electrical Characteristics

Data Sheet

DS60001666D - 34

11.2. Recommended Operating Conditions

Table 11-2. Recommended Operating Conditions

Parameter

Symbol

Rating

Unit

Min.

Typ.

Max.

Supply Voltage

VDDIO

3.00

3.30

3.60

VDDIN_AN

3.00

3.30

3.60

VDDIN

3.00

3.30

3.60

VDDPLL

1.15

1.25

1.32

VDDAMP

3.00

3.30

3.60

PVDDAMP

8.00

12.00(1)

16.00

Voltage of Analog Switch Outputs

VASO

-15

—

Junction Temperature

-40

125

ºC

Ambient Temperature

-40

—

Notes:

1. The PLC-protocol firmware provided by Microchip are configured by default for PVDDAMP = 12V.

Table 11-3. Thermal Resistance Data

Package

Symbol

Parameter

Condition

Typ.

Unit

TFBGA81

θJA

Junction-to-Ambient Thermal Resistance

Still Air

38.75

ºC/W

θJC

Junction-to-Case Thermal Resistance

—

12.9

θJA is calculated based on a standard JEDEC JESD51-5 defined environment (1.6 mm thickness PCB,

4 copper layers, 76.2 mm x 114.3 mm board) and is not a reliable indicator of a device’s thermal

performance in a non-JEDEC environment. It is recommended that the customer always perform

their own calculations or simulations to ensure that their system’s thermal performance is sufficient.

11.3. Electrical Pinout

Table 11-4. TFBGA81 Electrical Pinout

Pin No.

Pin Name

I/O

I(mA)

Res.

Pin No.

Pin Name

I/O

I(mA)

Res.

GND

—

TXRX1

I/O

±2/4

PU/PD/-

Y/-

—

EMIT3

±60(1)

—

ASI1

I/O

±2/4

PU/PD/-

Y/-

EMIT2

±60(1)

—

ASI0

I/O

±2/4

PU/PD/-

Y/-

VREGP (6)

—

VDDIN_AN

—

PVDDAMP

—

VREFP (6)

—

OUT

±1500 (2)

—

AGND

—

ASO1

1200 (3)

—

GND

—

PGND

—

VDDIO

—

AGC

±20 (4)

PU/-

—

VDDIO

—

GND

—

THW1

I/O

±2/4

PU/PD/-

Y/-

EMIT3

±60(1)

—

NTHW0

I/O

±2/4

PU/PD/-

Y/-

EMIT2

±60(1)

—

MISO

I/O

±2/4

PU/PD/-

Y/-

VREGN (6)

—

VREFC (6)

—

PVDDAMP

—

VREFN (6)

—

OUT

±1500 (2)

—

NRST

—

ASO1

1200 (3)

—

VDDIO

—

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