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RT3612EB bảng dữ liệu(PDF) 45 Page - Richtek Technology Corporation

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RT3612EB
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DS3612EB-02 December 2019
www.richtek.com
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Copyright 2019 Richtek Technology Corporation. All rights reserved.
is a registered trademark of Richtek Technology Corporation.
Thermal Considerations
The junction temperature should never exceed the
absolute maximum junction temperature TJ(MAX), listed
under Absolute Maximum Ratings, to avoid permanent
damage to the device. The maximum allowable power
dissipation depends on the thermal resistance of the IC
package, the PCB layout, the rate of surrounding airflow,
and the difference between the junction and ambient
temperatures. The maximum power dissipation can be
calculated using the following formula :
PD(MAX) = (TJ(MAX)
− TA) / θJA
where TJ(MAX) is the maximum junction temperature, TAis
the ambient temperature, and
θJA is the junction-to-ambient
thermal resistance.
For continuous operation, the maximum operating junction
temperature indicated under Recommended Operating
Conditions is 125
°C. The junction-to-ambient thermal
resistance,
θJA, is highly package dependent. For a
WQFN-32L 4x4 package, the thermal resistance,
θJA, is
27.8
°C/W on a standard JEDEC 51-7 high effective-thermal-
conductivity four-layer test board. The maximum power
dissipation at TA = 25
°C can be calculated as below :
PD(MAX) = (125
°C − 25°C) / (27.8°C/W) = 3.59W for a
WQFN-32L 4x4 package.
The maximum power dissipation depends on the operating
ambient temperature for the fixed TJ(MAX) and the thermal
resistance,
θJA. The derating curves in Figure 32 allows
the designer to see the effect of rising ambient temperature
on the maximum power dissipation.
Figure 32. Derating Curve of Maximum Power
Dissipation
0.0
0.4
0.8
1.2
1.6
2.0
2.4
2.8
3.2
3.6
4.0
0
25
50
75
100
125
Ambient Temperature (°C)
Four-Layer PCB



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