Table of Contents

1 Features............................................................................1

2 Applications..................................................................... 1

3 Description.......................................................................1

4 Revision History.............................................................. 2

5 Device Version Comparison........................................... 3

5.1 Device Variants........................................................... 3

6 Pin Configuration and Functions...................................4

7 Specifications.................................................................. 9

7.1 Absolute Maximum Ratings........................................ 9

7.2 ESD Ratings............................................................... 9

7.3 Recommended Operating Conditions.........................9

7.4 Thermal Information..................................................10

7.5 Electrical Characteristics...........................................10

7.6 Switching Characteristics..........................................16

7.7 Timing Requirements................................................17

7.8 Typical Characteristics.............................................. 20

8 Parameter Measurement Information.......................... 21

9 Detailed Description......................................................22

9.1 Overview................................................................... 22

9.2 Functional Block Diagram......................................... 22

9.3 Feature Description...................................................23

9.4 Device Functional Modes..........................................23

9.5 Manufacturing Test Modes........................................27

9.6 I2C Target Interface...................................................29

10 Register Access Protocol (RAP)................................ 31

11 Register Map................................................................ 32

11.1 TUSB2E11 Registers.............................................. 32

12 Application and Implementation................................ 44

12.1 Application Information........................................... 44

12.2 Typical Application.................................................. 44

12.3 Power Supply Recommendations...........................47

12.4 Layout..................................................................... 48

13 Device and Documentation Support..........................50

13.1 Device Support....................................................... 50

13.2 Documentation Support.......................................... 50

13.3 Receiving Notification of Documentation Updates..50

13.4 Support Resources................................................. 50

13.5 Trademarks.............................................................50

13.6 Electrostatic Discharge Caution..............................50

13.7 Glossary..................................................................50

14 Mechanical, Packaging, and Orderable

Information.................................................................... 50

4 Revision History

NOTE: Page numbers for previous revisions may differ from page numbers in the current version.

Changes from Revision A (June 2022) to Revision B (August 2023)

Page

• Updated the Package Information table to include package lead size...............................................................1

• Updated Recommended Operating Conditions to clarify the ROC for RESETB................................................ 9

• Updated register F5h to indicate OPN variants................................................................................................ 32

Changes from Revision * (November 2021) to Revision A (June 2022)

Page

• First public release of the data sheet..................................................................................................................1

TUSB2E11

SLLSFI4B – NOVEMBER 2021 – REVISED AUGUST 2023

www.ti.com

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