SPC572LX datasheet(94/112 Pages) STMICROELECTRONICS

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Package characteristics

SPC572Lx

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DocID027866 Rev 5

3. A1 is defined as the distance from the seating plane to the lowest point on the package body.

4. Dimension “b” does not include dambar protrusion. Allowable dambar protrusion shall not cause the lead width to exceed

the maximum “b” dimension by more than 0.08 mm. Dambar cannot be located on the lower radius or the foot. Minimum

space between protrusion and an adjacent lead is 0.07 mm for 0.4 mm and 0.5 mm pitch packages.

5. These dimensions apply to the flat section of the lead between 0.10 mm and 0.25 mm from the lead tip.

6. To be determined at seating datum plane C.

7. The Top package body size may be smaller than the bottom package size by as much as 0.15 mm.

8. Dimensions D1 and E1 do not include mold flash or protrusions. Allowable mold flash or protrusions is “0.25 mm” per side.

D1 and E1 are maximum plastic body size dimensions including mold mismatch.

9. Dimensions D2 and E2 show the maximum exposed metal area on the package surface where the exposed pad is located

(if present). It includes all metal protrusions from exposed pad itself. Type of exposed pad is variable depending on

leadframe pad design (T1, T2, T3). End user should verify D2 and E2 dimensions according to specific device application.

10. Dimensions D3 and E3 show the minimum solderable area, defined as the portion of exposed pad which is guaranteed to

be free from resin flashes/bleeds, bordered by internal edge of inner groove.

11. “N” is the number of terminal positions for the specified body size.

12. Tolerance

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