MCP3464T-ESLASHST datasheet(95/108 Pages) MICROCHIP

95 / 108 page

 2019-2021 Microchip Technology Inc.

DS20006180D-page 95

MCP3461/2/4

9.0

PACKAGING INFORMATION

9.1

Package Marking Information(2)

Legend: XX...X

Customer-specific information

Year code (last digit of calendar year)

Year code (last 2 digits of calendar year)

Week code (week of January 1 is week ‘01’)

NNN

Alphanumeric traceability code

Pb-free JEDEC designator for Matte Tin (Sn)

This package is Pb-free. The Pb-free JEDEC designator (

)

can be found on the outer packaging for this package.

Note 1:

In the event the full Microchip part number cannot be marked on one line, it will be carried over to the

next line, thus limiting the number of available characters for customer-specific information.

Denotes the device default SPI address option. Device only responds to SPI commands if CMD[7:6]

matches the SPI device address for each command (see

Section 6.2.2 “Device Address

Bits (CMD[7:6])”).

The 20-Lead TSSOP package allows up to 8 characters per line as shown here. Currently only 7

characters are being used as shown in the example.

Part Number

Code

SPI Device Address

MCP3461T-E/NC

AAE

01(2)

MCP3462T-E/NC

AAF

01(2)

MCP3464T-E/NC

AAG

01(2)

XXX

20-Lead UQFN (3 x 3 x 0.55 mm)

PIN 1

YYWW

NNN

AAE

Example

PIN 1

2112

256

XXXXXXXX

20-Lead TSSOP (6.5 x 4.4 x 1 mm)(3)

XXXXXNNN

YYWW

MCP3464

Example

EST 256

2112

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