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STM32H723VG bảng dữ liệu(PDF) 91 Page - STMicroelectronics |
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STM32H723VG bảng dữ liệu(HTML) 91 Page - STMicroelectronics |
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91 / 227 page ![]() DS13313 Rev 2 91/227 STM32H723xE/G Electrical characteristics 208 fCPU Arm® Cortex®-M7 clock frequency VOS3 - - 170 MHz VOS2 - - 300 VOS1 - - 400 VOS0 - - 520 VOS0 and CPU_FREQ_BOOST -- 550 fACLK AXI clock frequency VOS3 - - 85 VOS2 - - 150 VOS1 - - 200 VOS0 - - 275 fHCLK AHB clock frequency VOS3 - - 85 VOS2 - - 150 VOS1 - - 200 VOS0 - - 275 fPCLK APB clock frequency VOS3 - - 42.5(4) VOS2 - - 75 VOS1 - - 100 VOS0 - - 137.5 TA(5) Ambient temperature for temperature range 3 Maximum power dissipation −40 125 °C Ambient temperature for temperature range 6 Maximum power dissipation −40 85 Low-power dissipation(6) −40 105 1. When RESET is released, the functionality is guaranteed down to VPDRmax or down to the specified VDDmin when the PDR is OFF. The PDR can only be switched OFF though the PDR_ON pin that not available in all packages. 2. This formula has to be applied on power supplies related to the I/O structure described by the pin definition table. 3. At startup, the external VCORE voltage must remain higher or equal to 1.10 V before disabling the internal regulator (LDO). 4. This value corresponds to the maximum APB clock frequency when at least one peripheral is enabled. 5. The device junction temperature must be kept below maximum TJ indicated in Table 13: Supply voltage and maximum temperature configuration and the maximum temperature. 6. In low-power dissipation state, TA can be extended to this range as long as TJ does not exceed TJmax (see Section 7.5: Thermal characteristics). Table 12. General operating conditions (continued) Symbol Parameter Operating conditions Min Typ Max Unit |
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