TAS5822MDCPR datasheet(79/90 Pages) TI

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10 Layout

10.1 Layout Guidelines

10.1.1 General Guidelines for Audio Amplifiers

Audio amplifiers which incorporate switching output stages must have special attention paid to their layout and

the layout of the supporting components used around them. The system level performance metrics, including

thermal performance, electromagnetic compliance (EMC), device reliability, and audio performance are all

affected by the device and supporting component layout.

Ideally, the guidance provided in the applications section with regard to device and component selection can be

followed by precise adherence to the layout guidance shown in the Section 10.2 section. These examples

represent exemplary baseline balance of the engineering trade-offs involved with lying out the device. These

designs can be modified slightly as needed to meet the needs of a given application. In some applications, for

instance, solution size can be compromised to improve thermal performance through the use of additional

contiguous copper neat the device. Conversely, EMI performance can be prioritized over thermal performance

by routing on internal traces and incorporating a via picket-fence and additional filtering components. In all

cases, it is recommended to start from the guidance shown in the Section 10.2 section and work with TI field

application engineers or through the E2E community to modify it based upon the application specific goals.

10.1.2 Importance of PVDD Bypass Capacitor Placement on PVDD Network

Placing the bypassing and decoupling capacitors close to supply has long been understood in the industry. This

applies to DVDD, AVDD and PVDD. However, the capacitors on the PVDD net for the TAS5822M device

deserve special attention.

The small bypass capacitors on the PVDD lines of the DUT must be placed as close to the PVDD pins as

possible. Not only dose placing these device far away from the pins increase the electromagnetic interference in

the system, but doing so can also negatively affect the reliability of the device. Placement of these components

too far from the TAS5822M device can cause ringing on the output pins that can cause the voltage on the output

pin to exceed the maximum allowable ratings shown in the Absolute Maximum Ratings table, damaging the

deice . For that reason, the capacitors on the PVDD net must be no further away from their associated PVDD

pins than what is shown in the example layouts in the Section 10.2 section.

10.1.3 Optimizing Thermal Performance

Follow the layout example shown in the Figure 10-1 to achieve the best balance of solution size, thermal, audio,

and electromagnetic performance. In some cases, deviation from this guidance can be required due to design

constraints which cannot be avoided. In these instances, the system designer should ensure that the heat can

get out of the device and into the ambient air surrounding the device. Fortunately, the heat created in the device

naturally travels away from the device and into the lower temperature structures around the device.

10.1.3.1 Device, Copper, and Component Layout

Primarily, the goal of the PCB design is to minimize the thermal impedance in the path to those cooler structures.

These tips should be followed to achieve that goal:

• Avoid placing other heat producing components or structures near the amplifier (including above or below in

the end equipment).

• If possible, use a higher layer count PCB to provide more heat sinking capability for the TAS5822M device

and to prevent traces and copper signal and power planes from breaking up the contiguous copper on the top

and bottom layer.

• Place the TAS5822M device away from the edge of the PCB when possible to ensure that the heat can travel

away from the device on all four sides.

• Avoid cutting off the flow of heat from the TAS5822MM device to the surrounding areas with traces or via

strings. Instead, route traces perpendicular to the device and line up vias in columns which are perpendicular

to the device.

• Unless the area between two pads of a passive component is large enough to allow copper to flow in

between the two pads, orient it so that the narrow end of the passive component is facing the TAS5782M

device.

www.ti.com

TAS5822M

SLASEV8 – DECEMBER 2020

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