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CC3220MODASM2MONR bảng dữ liệu(PDF) 83 Page - Texas Instruments

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tên linh kiện CC3220MODASM2MONR
Giải thích chi tiết về linh kiện  SimpleLink Wi-Fi CERTIFIED Wireless MCU Modules
PDF  100 Pages
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nhà sản xuất  TI1 [Texas Instruments]
Trang chủ  http://www.ti.com
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CC3220MODASM2MONR bảng dữ liệu(HTML) 83 Page - Texas Instruments

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CC3220MOD, CC3220MODA
www.ti.com
SWRS206B – MARCH 2017 – REVISED AUGUST 2017
Submit Documentation Feedback
Product Folder Links: CC3220MOD CC3220MODA
Environmental Requirements and Specifications
Copyright © 2017, Texas Instruments Incorporated
8.5
Soldering and Reflow Condition
•
Heating method: Conventional convection or IR convection
•
Temperature measurement: Thermocouple d = 0.1 mm to 0.2 mm CA (K) or CC (T) at soldering
portion or equivalent method
•
Solder paste composition: Sn/3.0 Ag/0.5 Cu
•
Allowable
reflow
soldering
times:
2
times
based
on
the
reflow
soldering
profile
(see Figure 8-1)
•
Temperature profile: Reflow soldering will be done according to the temperature profile (see
Figure 8-1)
•
Peak temperature: 245°C
Figure 8-1. Temperature Profile for Evaluation of Solder Heat Resistance of a Component
(at Solder Joint)
NOTE
TI does not recommend the use of conformal coating or similar material on the SimpleLink
module. This coating can lead to localized stress on the solder connections inside the
module and impact the module reliability. Use caution during the module assembly process
to the final PCB to avoid the presence of foreign material inside the module.



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