CC3220MODASM2MONR datasheet(76/100 Pages) TI1

76 / 100 page

CC3220MOD, CC3220MODA

SWRS206B – MARCH 2017 – REVISED AUGUST 2017

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Applications, Implementation, and Layout

7.3

PCB Layout Guidelines

This section details the PCB guidelines to speed up the PCB design using the CC3220MODx and

CC3220MODAx modules. The integrator of the CC3220MODx and CC3220MODAx modules must comply

with the PCB layout recommendations described in the following subsections to minimize the risk with

regulatory certifications for the FCC, IC, CE, MIC, and SRRC. Moreover, TI recommends customers follow

the guidelines described in this section to achieve similar performance to that obtained with the TI

reference design.

7.3.1

General Layout Recommendations

Ensure that the following general layout recommendations are followed:

•

Have a solid ground plane and ground vias under the module for stable system and thermal

dissipation.

•

Do not run signal traces underneath the module on a layer where the module is mounted.

7.3.2

CC3220MODx RF Layout Recommendations

The RF section of this wireless module gets top priority in terms of layout. It is very important for the RF

section to be laid out correctly to ensure optimum performance from the module. A poor layout can cause

low-output power, EVM degradation, sensitivity degradation, and mask violations.

Figure 7-2 shows the RF placement and routing of the CC3220MODx module with external antenna.

Figure 7-2. RF Section Layout

Follow these RF layout recommendations for the CC320MODx device:

•

RF traces must have 50-Ω impedance.

•

RF trace bends must be made with gradual curves, and 90° bends must be avoided.

•

RF traces must not have sharp corners.

•

There must be no traces or ground under the antenna section.

•

RF traces must have via stitching on the ground plane beside the RF trace on both sides.

•

RF traces must be as short as possible. The antenna, RF traces, and the module must be on the edge

of the PCB product in consideration of the product enclosure material and proximity.

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