UPD78323LP datasheet(76/86 Pages) NEC

76 / 86 page

µPD78323, 78324

11. RECOMMENDED SOLDERING CONDITIONS

The

µPD78323 and 78324 should be soldered and mounted under the conditions recommended in the table below.

For detail of recommended soldering conditions, refer to the information document Semiconductor Device Mount-

ing Technology Manual (IE1-1207).

For soldering methods and conditions other than those recommended below, contact our salesman.

Table 11-1. Soldering Conditions for Surface Mount Type

µPD78323GJ-5BJ

: 74-pin plastic QFP (20

× 20 mm)

µPD78324GJ-×××-5BJ : 74-pin plastic QFP (20 × 20 mm)

Soldering Method

Soldering Conditions

Package peak temperature: 230

°C, Time: 30 sec. max. (at 210 °C or above)

Infrared reflow

Number of times: Once, Time limit: 7 daysNote (thereafter 10 hours prebaking

required at 125

°C)

Package peak temperature: 215

°C, Time: 40 sec. max. (at 200 °C or above)

VPS

Number of times: Once, Time limit: 7 daysNote (thereafter 10 hours prebaking

required at 125

°C)

Pin temperature: 300

°C max, Time: 3 sec. max. (Per side of the device)

Recommended

Condition Symbol

Soldering Method

Soldering Conditions

Package peak temperature: 235

°C, Time: 30 sec. max. (at 210 °C or above)

Number of times: twice or less, Time limit: 7 daysNote (thereafter 36 hours

prebaking required at 125 ˚C)

(1)

The second reflow should be started after the temperature of the device

which would have been changed by the first reflow has returned to normal.

(2)

Please avoid flux water washing after the first reflow.

Package peak temperature: 215

°C, Time: 40 sec. max. (at 200 °C or above),

Number of times: twice or less, Time limit: 7 daysNote (thereafter 36 hours

prebaking required at 125 ˚C)

(1)

The second reflow should be started after the temperature of the device

which would have been changed by the first reflow has returned to normal.

(2)

Please avoid flux water washing after the first reflow.

Pin temperature: 300

°C max., Time: 3 sec. max. (Per side of the device))

Recommended

Condition Symbol

Infrared reflow

IR30-367-2

VP15-367-2

µPD78323LP

: 68-pin plastic QFJ (

950 mil)

µPD78324LP-××× : 68-pin plastic QFJ ( 950 mil)

Pin part heating

IR30-107-1

VP15-107-1

VPS

Note For the storage period after dry-pack decompression, storage conditions are max. 25

°C, 65 % RH.

Caution Use more than one soldering method should be avoided (except in the case of pin part heating).

Pin part heating

UPD78323LP bảng dữ liệu(PDF) 76 Page - NEC

UPD78323LP bảng dữ liệu(HTML) 76 Page - NEC

Html Pages

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57 58 59 60 61 62 63 64 65 66 67 68 69 70 71 72 73 74 75 76 77 78 79 80 81 82 83 84 85 86

bảng dữ liệu tải về

Link URL