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STM32F407IE bảng dữ liệu(PDF) 68 Page - STMicroelectronics |
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STM32F407IE bảng dữ liệu(HTML) 68 Page - STMicroelectronics |
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68 / 154 page ![]() Electrical characteristics STM32F405xx, STM32F407xx 68/154 Doc ID 022152 Rev 1 I/O system current consumption The current consumption of the I/O system has two components: static and dynamic. I/O static current consumption All the I/Os used as inputs with pull-up generate current consumption when the pin is externally held low. The value of this current consumption can be simply computed by using the pull-up/pull-down resistors values given in Table 43: I/O static characteristics. For the output pins, any external pull-down or external load must also be considered to estimate the current consumption. Additional I/O current consumption is due to I/Os configured as inputs if an intermediate voltage level is externally applied. This current consumption is caused by the input Schmitt trigger circuits used to discriminate the input value. Unless this specific configuration is required by the application, this supply current consumption can be avoided by configuring these I/Os in analog mode. This is notably the case of ADC input pins which should be configured as analog pins. Caution: Any floating input pin can also settle to an intermediate voltage level or switch inadvertently, as a result of external electromagnetic noise. To avoid current consumption related to floating pins, they must either be configured in analog mode, or forced internally to a definite digital value. This can be done either by using pull-up/down resistors or by configuring the pins in output mode. I/O dynamic current consumption In addition to the internal peripheral current consumption measured previously (see Table 23: Peripheral current consumption), the I/Os used by an application also contribute to the current consumption. When an I/O pin switches, it uses the current from the MCU supply voltage to supply the I/O pin circuitry and to charge/discharge the capacitive load (internal or external) connected to the pin: Table 21. Typical and maximum current consumptions in VBAT mode (1) Symbol Parameter Conditions Typ Max Unit TA = 25 °C TA = 85 °C TA = 105 °C VDD = 1.8 V VDD= 2.4 V VDD = 3.3 V VDD = 3.6 V IDD_VBAT Backup domain supply current Backup SRAM ON, RTC ON TBD TBD TBD TBD(2) TBD(2) µA Backup SRAM OFF, low-speed oscillator and RTC ON TBD TBD TBD TBD(2) TBD(2) Backup SRAM ON, RTC OFF TBD TBD TBD TBD(2) TBD(2) Backup SRAM OFF, RTC OFF TBD TBD TBD TBD(2) TBD(2) 1. TBD stands for “to be defined”. 2. Based on characterization, not tested in production. I SW V DD f SW C × × = |
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