ADSP-BF504 datasheet(79/80 Pages) AD

79 / 80 page

Preliminary Technical Data

Rev. PrC

Page 79 of 80

January 2010

ADSP-BF504/F,ADSP-BF506F

SURFACE MOUNT DESIGN

Table 56 is provided as an aide to PCB design. For industry-

standard design recommendations, refer to IPC-7351, Generic

Requirements for Surface Mount Design and Land Pattern

Standard.

ORDERING GUIDE

Figure 100. 88-Lead LFCSP (BC-CP-1)

COMPLIANT TO JEDEC STANDARDS MO-220-VRRD.

0.50

0.40

0.30

0.23

0.18

10.50

REF

0.60 MAX

0.60

MAX

6.70

REF SQ

0.50

BSC

0.138~0.194 REF

12° MAX

SEATING

PLANE

TOP VIEW

EXPOSED PAD

BOTTOM VIEW

0.85

0.80

0.75

0.70

0.65

0.60

0.045

0.025

0.005

PIN 1

INDICATOR

12.10

12.00 SQ

11.90

11.85

11.75 SQ

11.65

PIN 1

INDICATOR

FOR PROPER CONNECTION OF

THE EXPOSED PAD, REFER TO

THE PIN CONFIGURATION AND

FUNCTION DESCRIPTIONS

SECTION OF THIS DATA SHEET.

Table 56. Surface Mount Design Supplement

Package

Ball Attach Type

Solder Mask Opening

Lead Pad Size

120-Lead LQFP

Solder Mask Defined

TBD mm diameter

88-Lead LFCSP

Solder Mask Defined

TBD mm diameter

Table 57. ADSP-BF50x Processors1

1 For feature comparison between ADSP-BF504, ADSP-BF504F, and ADSP-BF506F processors, see the Processor Comparison in Table 1 on Page 3.

Model

Temperature

Range

2 Referenced temperature is ambient temperature.

Processor Instruction

Rate (Max)

Package Description

Package

Option

ADSPBF504BCPZ-ENG

–40ºC to +85ºC

400 MHz

88-Lead LFCSP

BC-CP-1

ADSPBF504FBCPZ-ENG

–40ºC to +85ºC

400 MHz

88-Lead LFCSP

BC-CP-1

ADSPBF506FBSWZ-ENG

–40ºC to +85ºC

400 MHz

120-Lead LQFP

SQ-120-2

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