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TAS5802PWPR bảng dữ liệu(PDF) 87 Page - Texas Instruments

tên linh kiện TAS5802PWPR
Giải thích chi tiết về linh kiện  TAS5802 22W Stereo, Inductor-Less, Digital Input, Closed-Loop Class-D Audio Amplifier with 96Khz Extended Processing and Low Idle Power Dissipation
PDF  106 Pages
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Trang chủ  https://www.ti.com
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8.3.1 DVDD Supply
The DVDD supply that is required from the system is used to power several portions of the device. As shown
in Figure 8-3, it provides power to the DVDD pin. Proper connection, routing and decoupling techniques are
highlighted in Section 8 and Section 8.4.2 and must be followed as closely as possible for proper operation and
performance.
Some portions of the device also require a separate power supply that is a lower voltage than the DVDD
supply. To simplify the power supply requirements for the system, the TAS5802 device includes an integrated
low dropout (LDO) linear regulator to create this supply. This linear regulator is internally connected to the DVDD
supply and its output is presented on the DVDD_REG pin, providing a connection point for an external bypass
capacitor. It is important to note that the linear regulator integrated in the device has only been designed to
support the current requirements of the internal circuitry, and should not be used to power any additional external
circuitry. Additional loading on this pin could cause the voltage to sag, negatively affecting the performance and
operation of the device.
8.3.2 PVDD Supply
The output stage of the speaker amplifier drives the load using the PVDD supply. This is the power supply which
provides the drive current to the load during playback. Proper connection, routing, and decoupling techniques
are highlighted in the TAS5802EVM and must be followed as closely as possible for proper operation and
performance. Due to the high-voltage switching of the output stage, it is particularly important to properly
decouple the output power stages in the manner described in the TAS5802 device Section 8. Lack of proper
decoupling, like that shown in the Section 8, results in voltage spikes which can damage the device.
A separate power supply is required to drive the gates of the MOSFETs used in the output stage of the speaker
amplifier. This power supply is derived from the PVDD supply via an integrated linear regulator. A GVDD pin is
provided for the attachment of decoupling capacitor for the gate drive voltage regulator. It is important to note
that the linear regulator integrated in the device has only been designed to support the current requirements of
the internal circuitry, and should not be used to power any additional external circuitry. Additional loading on this
pin could cause the voltage to sag, negatively affecting the performance and operation of the device.
Another separate power supply is derived from the PVDD supply via an integrated linear regulator is AVDD.
AVDD pin is provided for the attachment of decoupling capacitor for the TAS5802 internal circuitry. It is
important to note that the linear regulator integrated in the device has only been designed to support the current
requirements of the internal circuitry, and should not be used to power any additional external circuitry. Additional
loading on this pin could cause the voltage to sag, negatively affecting the performance and operation of the
device.
8.4 Layout
8.4.1 Layout Guidelines
8.4.1.1 General Guidelines for Audio Amplifiers
Audio amplifiers which incorporate switching output stages must have special attention paid to their layout and
the layout of the supporting components used around them. The system level performance metrics, including
thermal performance, electromagnetic compliance (EMC), device reliability, and audio performance are all
affected by the device and supporting component layout.
Ideally, the guidance provided in the applications section with regard to device and component selection can
be followed by precise adherence to the layout guidance shown in Section 8.4.2. These examples represent
exemplary baseline balance of the engineering trade-offs involved with lying out the device. These designs can
be modified slightly as needed to meet the needs of a given application. In some applications, for instance,
solution size can be compromised to improve thermal performance through the use of additional contiguous
copper neat the device. Conversely, EMI performance can be prioritized over thermal performance by routing
on internal traces and incorporating a via picket-fence and additional filtering components. In all cases, it is
recommended to start from the guidance shown in Section 8.4.2 and work with TI field application engineers or
through the E2E community to modify it based upon the application specific goals.
www.ti.com
TAS5802
SLASFB7A – NOVEMBER 2024 – REVISED AUGUST 2025
Copyright © 2025 Texas Instruments Incorporated
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