ADC3683 datasheet(67/70 Pages) TI1

tên linh kiện	ADC3683

Giải thích chi tiết về linh kiện	ADC3683-SP Space Grade 18-Bit 1 to 65MSPS, Low Noise, Ultra-low Power Dual Channel ADC

PDF	70 Pages

Scroll/Zoom	100%

nhà sản xuất	TI1 [Texas Instruments]

Trang chủ	http://www.ti.com

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67 / 70 page

12.1 Mechanical Data

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PACKAGE OUTLINE

(

HEAT SINK

64X 0.27

0.17

10.16 0.08

4X 7.5 0.13

60X 0.5 0.05

3.53 MAX

8 0.13

HEAT SINK

1.5 0.1

64X 0.15

0.05

(0.1) TYP

1.45 0.15

11.03

10.77

(0.3)

4X 9.5 0.13

4X (3.43)

29.36 0.38

64X 0.5 MAX

0.76 0.13

29.36 0.38

(0.417) TYP

(R0.75)

4X (1.78)

4X (1.1)

8X (R0.55)

CFP - 3.53 mm max height

HBP0064A

CERAMIC FLATPACK

4228542/A 03/2022

NOTES:

1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing

per ASME Y14.5M.

2. This drawing is subject to change without notice.

3. This package is hermetically sealed with a metal lid.

4. Ground pad to be electronic connected to heat sink and seal ring.

5. The leads are gold plated and can be solder dipped.

4X (45 X 0.3)

SEAL RING

4X (

0.38)

SYMM

SCALE 0.800

SYMM

PIN 1 ID

BOTTOM VIEW

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ADC3683-SP

SBASAB5 – MARCH 2024

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