NXP Semiconductors

MPL115A1S

Miniature SPI digital barometer, 50 kPa to 115 kPa

13 Soldering

1. Use SAC solder alloy, Sn-Ag-Cu, with a melting point of about 217 °C. NXP recommends using SAC305,

Sn-3.0 wt.% Ag-0.5 wt.% Cu.

2. Reflow

• Ramp up rate: 2 °C/s to 3 °C/s.

• Preheat flat (soak): 110 s to 130 s.

• Reflow peak temperature: 250 °C to 260 °C (depends on exact SAC alloy composition).

• Time above 217°C: 40 s to 90 s (depends on board type, thermal mass of the board/quantities in the

reflow).

• Ramp down: 5 °C/s to 6 °C/s.

• Using an inert reflow environment (with O2 level about 5 ppm to 15 ppm).

Note: The stress level and signal offset of the device also depends on the board type, board core material,

board thickness, and metal finishing of the board.

14 Soldering/landing pad information

The LGA package is compliant with the RoHS standard. NXP recommends using a no-clean solder paste to

reduce cleaning exposure to high pressure and chemical agents that can damage or reduce life span of the

Pressure sensing element.

aaa-046324

pin 1 index area

0.55 (8x)

1

8

4

5

0.10 (8x)

0.05 (8x)

BLACK for Package Outline

RED for PCB Landing Pattern

0.8 ± 0.05

(8x)

0.5 ± 0.05

(8x)

1.25 (6x)

(2x)

0.625

1.0

(8x)

Figure 12. Recommended PCB landing pattern

MPL115A1S

All information provided in this document is subject to legal disclaimers.

© 2023 NXP B.V. All rights reserved.

Product data sheet

Rev. 1.2 — 8 May 2023

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