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HIP2210EVAL1Z bảng dữ liệu(PDF) 25 Page - Renesas Technology Corp

tên linh kiện HIP2210EVAL1Z
Giải thích chi tiết về linh kiện  100V, 3A Source, 4A Sink, High Frequency Half-Bridge Drivers with HI/LI or Tri-Level PWM Input and Adjustable Dead Time
PDF  28 Pages
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nhà sản xuất  RENESAS [Renesas Technology Corp]
Trang chủ  http://www.renesas.com
Logo RENESAS - Renesas Technology Corp

HIP2210EVAL1Z bảng dữ liệu(HTML) 25 Page - Renesas Technology Corp

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HIP2210, HIP2211
8. Package Outline Drawings
FN9347 Rev.1.01
Page 25 of 27
Jun.23.20
8.
Package Outline Drawings
L10.4x4
10 Lead Thin Dual Flat No-Lead Plastic Package (TDFN)
Rev 2, 4/15
TYPICAL RECOMMENDED LAND PATTERN
DETAIL "X"
SIDE VIEW
TOP VIEW
BOTTOM VIEW
either a mold or mark feature.
4.00
2.60
0.15
(3.80)
(4X)
(10X 0.30)
(8X 0.8)
0 .75
BASE PLANE
C
SEATING PLANE
0.08
C
0.10
C
10 X 0.30
SEE DETAIL "X"
0.10
4
CA
MB
INDEX AREA
6
PIN 1
4.00
A
B
PIN #1 INDEX AREA
BSC
3.2 REF
8X 0.80
6
(10 X 0.60)
0 . 00 MIN.
0 . 05 MAX.
C
0 . 2 REF
10X 0 . 40
3.00
(2.60)
( 3.00 )
0.05 M C
6
5
10
1
located within the zone indicated. The pin #1 identifier may be
Unless otherwise specified, tolerance : Decimal ± 0.05
The configuration of the pin #1 identifier is optional, but must be
between 0.15mm and 0.30mm from the terminal tip.
Dimension b applies to the metallized terminal and is measured
Dimensions in ( ) for Reference Only.
Dimensioning and tolerancing conform to AMSE Y14.5m-1994.
6.
either a mold or mark feature.
3.
5.
4.
2.
Dimensions are in millimeters.
1.
NOTES:
Tiebar shown (if present) is a non-functional feature and may
be located on any of the 4 sides (or ends).
For the most recent package outline drawing, see L10.4x4.



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