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VSC8658 bảng dữ liệu(PDF) 95 Page - Microsemi Corporation |
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VSC8658 bảng dữ liệu(HTML) 95 Page - Microsemi Corporation |
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95 / 95 page ![]() Ordering Information VMDS-10242 VSC8658 Datasheet Revision 4.1 87 10 Ordering Information The VSC8658 device is available in two package types. VSC8658HJ is a 444-pin, thermally enhanced, plastic ball grid array (BGA) with a 27 mm × 27 mm body size, 1 mm pin pitch, and a 2.36 mm maximum height. The device is also available in a lead(Pb)-free package, VSC8658XHJ. Lead(Pb)-free products from Microsemi comply with the temperatures and profiles defined in the joint IPC and JEDEC standard IPC/JEDEC J-STD-020. For more information, see the IPC and JEDEC standard. The following table lists the ordering information for the VSC8658 device. Table 92 • Ordering Information Part Order Number Description VSC8658HJ 444-pin, thermally enhanced, plastic BGA with a 27 mm × 27 mm body size, 1 mm pin pitch, and a 2.36 mm maximum height VSC8658XHJ Lead(Pb)-free, 444-pin, thermally enhanced, plastic BGA with a 27 mm × 27 mm body size, 1 mm pin pitch, and a 2.36 mm maximum height |
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