STM8S005C6 datasheet(91/97 Pages) STMICROELECTRONICS

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STM8S005C6 STM8S005K6

Package information

10.3

Thermal characteristics

The maximum chip junction temperature (TJmax) must never exceed the values given in

Table 17: General operating conditions.

The maximum chip-junction temperature, TJmax, in degrees Celsius, may be calculated

using the following equation:

TJmax = TAmax + (PDmax x JA)

Where:



TAmax is the maximum ambient temperature in C



JA is the package junction-to-ambient thermal resistance in C/W



PDmax is the sum of PINTmax and PI/Omax (PDmax = PINTmax + PI/Omax)



PINTmax is the product of IDD and VDD, expressed in Watts. This is the maximum chip

internal power.



PI/Omax represents the maximum power dissipation on output pins, where:

PI/Omax = (VOL*IOL) + ((VDD-VOH)*IOH), and taking account of the actual VOL/IOL and

VOH/IOH of the I/Os at low and high level in the application.

10.3.1

Reference document

JESD51-2 integrated circuits thermal test method environment conditions - natural

convection (still air). Available from www.jedec.org.

Table 52. Thermal characteristics(1)

Thermal resistances are based on JEDEC JESD51-2 with 4-layer PCB in a natural convection

environment.

Symbol

Parameter

Value

Unit



Thermal resistance junction-ambient



LQFP 48 - 7 x 7 mm

°C/W

Thermal resistance junction-ambient



LQFP 32 - 7 x 7 mm

°C/W

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