MSP430F423IPM datasheet(21/59 Pages) TI1

21 / 59 page

MSP430F427, MSP430F425, MSP430F423

www.ti.com

SLAS421B – APRIL 2004 – REVISED NOVEMBER 2016

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Product Folder Links: MSP430F427 MSP430F425 MSP430F423

Specifications

(1)

The parasitic capacitance from the package and board may be estimated to be 2 pF. The effective load capacitor for the crystal is

(CXIN × CXOUT) / (CXIN + CXOUT). This is independent of XTS_FLL.

(2)

To improve EMI on the low-power LFXT1 oscillator, particularly in the LF mode (32 kHz), the following guidelines should be observed.

•

Keep the trace between the device and the crystal as short as possible.

•

Design a good ground plane around the oscillator pins.

•

Prevent crosstalk from other clock or data lines into oscillator pins XIN and XOUT.

•

Avoid running PCB traces underneath or adjacent to the XIN and XOUT pins.

•

Use assembly materials and processes that avoid any parasitic load on the oscillator XIN and XOUT pins.

•

If conformal coating is used, ensure that it does not induce capacitive or resistive leakage between the oscillator pins.

•

Do not route the XOUT line to the JTAG header to support the serial programming adapter as shown in other documentation. This

signal is no longer required for the serial programming adapter.

(3)

TI recommends external capacitance for precision real-time clock applications; OSCCAPx = 0h.

(4)

Applies only when using an external logic-level clock source. XTS_FLL must be set. Not applicable when using a crystal or resonator.

5.19 Crystal Oscillator, LFXT1 Oscillator

(1) (2)

over recommended operating free-air temperature range (unless otherwise noted)

PARAMETER

TEST CONDITIONS

VCC

MIN

TYP

MAX

UNIT

CXIN

Integrated input capacitance(3)

OSCCAPx = 0h

3 V

OSCCAPx = 1h

OSCCAPx = 2h

OSCCAPx = 3h

CXOUT Integrated output capacitance

(3)

OSCCAPx = 0h

3 V

OSCCAPx = 1h

OSCCAPx = 2h

OSCCAPx = 3h

VIL

Input levels at XIN(4)

3 V

VSS

0.2 × VCC

VIH

0.8 × VCC

VCC

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