UPD750064CU datasheet(72/82 Pages) NEC

72 / 82 page

µPD750064, 750066, 750068, 750064(A), 750066(A), 750068(A)

Data Sheet U10165EJ2V0DS00

15. RECOMMENDED SOLDERING CONDITIONS

The

µPD750068 should be soldered and mounted under the following recommended conditions.

For the details of the recommended soldering conditions, refer to the document Semiconductor Device

Mounting Technology Manual (C10535E).

For soldering methods and conditions other than those recommended below, contact your NEC sales

representative.

Table 15-1. Surface Mounting Type Soldering Conditions

µPD750064GT-×××

: 42-pin plastic shrink SOP (375 mil, 0.8-mm pitch)

µPD750066GT-×××

: 42-pin plastic shrink SOP (375 mil, 0.8-mm pitch)

µPD750068GT-×××

: 42-pin plastic shrink SOP (375 mil, 0.8-mm pitch)

µPD750064GT(A)-××× : 42-pin plastic shrink SOP (375 mil, 0.8-mm pitch)

µPD750066GT(A)-××× : 42-pin plastic shrink SOP (375 mil, 0.8-mm pitch)

µPD750068GT(A)-××× : 42-pin plastic shrink SOP (375 mil, 0.8-mm pitch)

Soldering Method

Soldering Conditions

Recommended

Condition Symbol

Infrared reflow

Package peak temperature: 235˚C, Time: 30 sec. Max. (at 210˚C or higher), IR35-00-2

Count: two times or less

VPS

Package peak temperature: 215˚C, Time: 40 sec. Max. (at 200˚C or higher), VP15-00-2

Count: two times or less

Wave soldering

Solder bath temperature: 260˚C Max., Time: 10 sec. Max.,

WS60-00-1

Count: once

Preheating temperature: 120˚C Max. (package surface temperature)

Partial heating

Pin temperature: 300˚C Max., Time: 3 sec. Max. (per pin row)

—

Caution Do not use different soldering methods together (except for partial heating).

Table 15-2. Through Hole Type Soldering Conditions

µPD750064CU-×××

: 42-pin plastic shrink DIP (600 mil, 1.778-mm pitch)

µPD750066CU-×××

: 42-pin plastic shrink DIP (600 mil, 1.778-mm pitch)

µPD750068CU-×××

: 42-pin plastic shrink DIP (600 mil, 1.778-mm pitch)

µPD750064CU(A)-××× : 42-pin plastic shrink DIP (600 mil, 1.778-mm pitch)

µPD750066CU(A)-××× : 42-pin plastic shrink DIP (600 mil, 1.778-mm pitch)

µPD750068CU(A)-××× : 42-pin plastic shrink DIP (600 mil, 1.778-mm pitch)

Soldering Method

Soldering Conditions

Wave soldering (pin only)

Solder bath temperature: 260˚C Max., Time: 10 sec. Max.

Partial heating

Pin temperature: 300˚C Max., Time: 3 sec. Max. (per pin)

Caution

In wave soldering, apply solder only to the pins. Care must be taken that

jet solder does not come in contact with the main body of the package.

UPD750064CU bảng dữ liệu(PDF) 72 Page - NEC

UPD750064CU bảng dữ liệu(HTML) 72 Page - NEC

Html Pages

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57 58 59 60 61 62 63 64 65 66 67 68 69 70 71 72 73 74 75 76 77 78 79 80 81 82

bảng dữ liệu tải về

Link URL