SPC5644AF0MLU2 datasheet(71/138 Pages) FREESCALE

71 / 138 page

MPC5644A Microcontroller Data Sheet, Rev. 7

Freescale Semiconductor

•

B. Joiner and V. Adams, “Measurement and Simulation of Junction to Board Thermal Resistance and Its Application

in Thermal Modeling,” Proceedings of SemiTherm, San Diego, 1999, pp. 212-220.

3.4

EMI (electromagnetic interference) characteristics

3.5

Electrostatic discharge (ESD) characteristics

Table 12. EMI Testing Specifications1

1 EMI testing and I/O port waveforms per SAE J1752/3 issued 1995-03 and IEC 61967-2.

Symbol

Parameter

Conditions

Clocks

Frequency

Range

Level

(Max)

Unit

Radiated

emissions,

electric field

VRE_TEM

VDDREG =5.25V;

TA =25°C

150 kHz – 30 MHz

RBW 9 kHz, Step

Size 5 kHz

30 MHz – 1 GHz -

RBW 120 kHz, Step

Size 80 kHz

16 MHz crystal

40 MHz bus

No PLL frequency

modulation

150 kHz – 50 MHz

V

50 – 150 MHz

150 – 500 MHz

500 – 1000 MHz

IEC Level

—

SAE Level

—

16 MHz crystal

40 MHz bus

±2% PLL

frequency

modulation

150 kHz– 50 MHz

V

50 – 150 MHz

150 – 500 MHz

500 – 1000 MHz

IEC Level

—

SAE Level

—

Table 13. ESD ratings1,2

1 All ESD testing is in conformity with CDF-AEC-Q100 Stress Test Qualification for Automotive Grade Integrated

Circuits.

Symbol

Parameter

Conditions

Value

Unit

—

ESD for Human Body Model (HBM)

—

2000

HBM circuit description

—

1500



CSR

—

100

—

ESD for field induced charge Model

(FDCM)

All pins

500

Corner pins

750

—

Number of pulses per pin

Positive pulses (HBM)

—

Negative pulses (HBM)

—

Number of pulses

—

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