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ADSP-21469KBZ-ENG2 bảng dữ liệu(PDF) 51 Page - Analog Devices

tên linh kiện ADSP-21469KBZ-ENG2
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ADSP-21469KBZ-ENG2 bảng dữ liệu(HTML) 51 Page - Analog Devices

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ADSP-21469/ADSP-21469W
Preliminary Technical Data
Rev. PrB
|
Page 51 of 56
|
November 2008
THERMAL CHARACTERISTICS
The ADSP-21469 processor is rated for performance over the
temperature range specified in Operating Conditions on
Page 16.
Table 47 airflow measurements comply with JEDEC standards
JESD51-2 and JESD51-6 and the junction-to-board measure-
ment complies with JESD51-8. Test board design complies with
JEDEC standards JESD51-7 (PBGA). The junction-to-case mea-
surement complies with MIL- STD-883. All measurements use a
2S2P JEDEC test board.
To determine the junction temperature of the device while on
the application PCB, use:
where:
TJ = junction temperature °C
TCASE = case temperature (°C) measured at the top center of the
package
ΨJT = junction-to-top (of package) characterization parameter
is the Typical value from Table 47.
PD = power dissipation
Values of
θJA are provided for package comparison and PCB
design considerations.
θJA can be used for a first order approxi-
mation of TJ by the equation:
where:
TA = ambient temperature °C
Values of
θJC are provided for package comparison and PCB
design considerations when an external heatsink is required.
Values of
θJB are provided for package comparison and PCB
design considerations. Note that the thermal characteristics val-
ues provided in Table 47 are modeled values.
Figure 44. Typical Output Delay or Hold vs. Load Capacitance
(at Ambient Temperature)
8
0
0
100
250
12
4
2
10
6
200
150
50
TBD
T
J
T
CASE
Ψ
JT
P
D
×
()
+
=
T
J
T
A
θ
JA
P
D
×
()
+
=
Table 47. Thermal Characteristics for 324-Lead PBGA
Parameter
Condition
Typical
Unit
θJA
Airflow = 0 m/s
TBD
°C/W
θJMA
Airflow = 1 m/s
TBD
°C/W
θJMA
Airflow = 2 m/s
TBD
°C/W
θJC
TBD
°C/W
ΨJT
Airflow = 0 m/s
TBD
°C/W
ΨJMT
Airflow = 1 m/s
TBD
°C/W
ΨJMT
Airflow = 2 m/s
TBD
°C/W



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