TDF8599TH datasheet(27/52 Pages) NXP

27 / 52 page

TDF8599_1

Product data sheet

Rev. 01 — 13 November 2008

27 of 52

NXP Semiconductors

TDF8599

Class-D power ampliﬁer with load diagnostics

10. Limiting values

[1]

Floating condition assumed for outputs.

[2]

Current limiting concept.

[3]

Human Body Model (HBM).

[4]

Charged-Device Model (CDM).

[5]

The output pins are deﬁned as the output pins of the ﬁlter connected between the TDF8599 output pins and

the load.

11. Thermal characteristics

Table 17.

Limiting values

In accordance with the Absolute Maximum Rating System (IEC 60134).

Symbol

Parameter

Conditions

Min

Max

Unit

supply voltage

Operating mode

off state

[1]

−150

load dump; duration

50 ms, tr >2.5 ms

-50

IORM

repetitive peak output

current

maximum output current

limiting

[2] 8-

IOM

peak output current

maximum; non-repetitive

[2] -12

input voltage

pins SCL, SDA, ADS,

MOD, SSM, OSCIO, EN

and SEL_MUTE

5.5

output voltage

pins DIAG and CLIP

junction temperature

150

°C

Tstg

storage temperature

−55

+150

°C

Tamb

ambient temperature

−40

+85

°C

VESD

electrostatic discharge

voltage

HBM

[3]

C = 100 pF;

Rs = 1500 Ω

2000

CDM

[4]

non-corner pins

500

corner pins

750

V(prot)

protection voltage

AC and DC short circuit

voltage of output pins

across load and to

supply and ground

[5] 0Vp

Pmax

maximum power dissipation

Tcase =70 °C

Table 18.

Thermal characteristics

Symbol

Parameter

Conditions

Typ

Unit

Rth(j-a)

thermal resistance from junction

to ambient

in free air

K/W

Rth(j-c)

thermal resistance from junction

to case

K/W

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