ADC12D040

SNAS171E – JUNE 2002 – REVISED MARCH 2013

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Absolute Maximum Ratings

(1) (2) (3)

VA, VD, VDR

6.5V

VDR

VD + 0.3V

|VA–VD|

≤ 100 mV

Voltage on Any Input or Output Pin

−0.3V to (VA or VD +0.3V)

Input Current at Any Pin(4)

±25 mA

Package Input Current(4)

±50 mA

Package Dissipation at TA = 25°C

See (5)

ESD Susceptibility(6)

Human Body Model

2500V

Machine Model

250V

Soldering Temperature, Infrared, 10 sec.(7)

235°C

Storage Temperature

−65°C to +150°C

(1)

All voltages are measured with respect to GND = AGND = DGND DR GND = 0V, unless otherwise specified.

(2)

Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for

which the device is functional, but do not guarantee specific performance limits. For guaranteed specifications and test conditions, see

the Electrical Characteristics. The guaranteed specifications apply only for the test conditions listed. Some performance characteristics

may degrade when the device is not operated under the listed test conditions.

(3)

If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/ Distributors for availability and

specifications.

(4)

When the input voltage at any pin exceeds the power supplies (that is, VIN < AGND, or VIN > VA), the current at that pin should be

limited to 25 mA. The 50 mA maximum package input current rating limits the number of pins that can safely exceed the power supplies

with an input current of 25 mA to two.

(5)

The absolute maximum junction temperature (TJmax) for this device is 150°C. The maximum allowable power dissipation is dictated by

TJmax, the junction-to-ambient thermal resistance (θJA), and the ambient temperature, (TA), and can be calculated using the formula

PDMAX = (TJmax - TA )/θJA. The values for maximum power dissipation listed above will be reached only when the device is operated in

a severe fault condition (e.g. when input or output pins are driven beyond the power supply voltages, or the power supply polarity is

reversed). Obviously, such conditions should always be avoided.

(6)

Human body model is 100 pF capacitor discharged through a 1.5 k

Ω resistor. Machine model is 220 pF discharged through 0Ω.

(7)

The 235°C reflow temperature refers to infrared reflow. For Vapor Phase Reflow (VPR), the following Conditions apply: Maintain the

temperature at the top of the package body above 183°C for a minimum 60 seconds. The temperature measured on the package body

must not exceed 220°C. Only one excursion above 183°C is allowed per reflow cycle.

Operating Ratings

(1) (2)

Operating Temperature

−40°C ≤ TA ≤ +85°C

Supply Voltage (VA, VD)

+4.75V to +5.25V

Output Driver Supply (VDR)

+2.35V to VD

VREF Input

1.0V to 2.4V

CLK, PD, OE

−0.5V to (VD + 0.5V)

Analog Input Pins

−0V to (VA − 0.5V)

Input Common Mode Voltage (VCM)

VREF/2 to VA − VREF

|AGND–DGND|

≤100mV

(1)

Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for

which the device is functional, but do not guarantee specific performance limits. For guaranteed specifications and test conditions, see

the Electrical Characteristics. The guaranteed specifications apply only for the test conditions listed. Some performance characteristics

may degrade when the device is not operated under the listed test conditions.

(2)

All voltages are measured with respect to GND = AGND = DGND DR GND = 0V, unless otherwise specified.

Package Thermal Resistance

Package

θJ-A

64-Lead TQFP

50°C / W

6

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