ZAMC4100GA2R datasheet(14/156 Pages) RENESAS

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ZAMC4100 Datasheet

January 26, 2016

IC Characteristics

1.1.

Absolute Maximum Ratings

Stresses above those listed in this clause may cause immediate and permanent device failure. It is not implied

that more than one of these conditions can be applied simultaneously. Operation outside the operating ranges for

extended periods may affect device reliability. Total cumulative dwell time above the maximum operating rating

for power supply or temperature must be less than 100 hours.

Table 1.1

Absolute Maximum Ratings

Parameter

Symbol

Value

UNIT

Supply Voltage

System supply voltage

VVDDE

-0.3 to 28

System supply voltage under transient conditions

VVDDE_max

-0.3 to 40

Input Pin Voltage

AIN1-4

VIN(ANALOG)

-0.3 to 5.5

GPIO0-7

VIN(MCU)

-0.3 to 3.6

LIN Bus Voltage

Bus voltage

VBUS(SS)

-18 to 40

Transient input voltage (per ISO7637 Specification)

VBUS(PK)

-150 to 100

GPIO Supply current

Total GPIO sink/source current (referenced to 3.3V)

IGPIO

Table 1.2

Thermal Specifications

Parameter

Symbol

Value

UNIT

Thermal Ratings

Operating ambient temperature

-40 to 85

˚C

Operating junction temperature

1), 2)

-40 to 125

˚C

Storage temperature

TSTG

-40 to 150

˚C

Thermal Characteristics

Thermal resistance junction to case

3),4)

ΘJC

0.4

˚C/W

Thermal resistance junction to ambient

3),4)

ΘJA

˚C/W

The limiting factor is the operating temperature of the FLASH memory within the MCU where the data retention is guaranteed for temperatures up to

85˚C. In order to keep the MCU temperature below 85˚C when the SBC is running at maximum temperature, the application should provide a sufficient

heat sink. For more information, contact IDT technical support.

The device will automatically shut down the drivers at 125°C.

IDT uses test boards in conformance with the JESD51-7 (JEDEC) for thermal impedance measurement.

This value applies for the JEDEC board profile and specific environment only for package performance comparison. Care should be taken when apply-

ing in the actual application where the printed circuit board (PCB) profile and environment are different. Contact IDT technical support for assistance.

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