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DSP56600FM/AD bảng dữ liệu(PDF) 63 Page - NXP Semiconductors

tên linh kiện DSP56600FM/AD
Giải thích chi tiết về linh kiện  INTEGRATED CELLULAR BASEBAND PROCESSOR DEVELOPMENT IC
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DSP56600FM/AD bảng dữ liệu(HTML) 63 Page - NXP Semiconductors

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Preliminary
MOTOROLA
DSP56651 Technical Data Sheet
3-1
SECTION
3
PACKAGING
PACKAGE INFORMATION
This section provides information about the available packages for this product. The
DSP56651 is available in a 196-pin plastic ball grid array (PBGA) package.
The DSP56651 part (RAM-based DSP program memory) is delivered in a 17-mm
(outline) PBGA
package having a solder-ball footprint identical to that of the
15 mm PBGA. Compatibility between the footprints of the two packages is
maintained to minimize impact to the customer’s application board routing, such
that the same board can be used for both the DSP56651 and DSP56652.
196 PBGA (GT), 17 x 17 mm, with Footprint of 15-mm PBGA
The DSP56651 is offered in the non-JEDEC standard, 17-mm PBGA package. The
package is “non-standard” in that the single outermost row of solder balls in the
array is removed, leaving a 14 x 14 array (196) of solder balls. This package footprint
is identical to that of the JEDEC standard 15 mm (outline) 196 PBGA. The pitch of the
solder balls is 1 mm. Refer to the following table and figure for package drawing
and dimensions.
Freescale Semiconductor, Inc.
For More Information On This Product,
Go to: www.freescale.com



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