DSP56600FMSLASHAD datasheet(44/76 Pages) NXP

44 / 76 page

Preliminary

2-2

DSP56651 Technical Data Sheet

MOTOROLA

Specifications

Thermal characteristics

THERMAL CHARACTERISTICS

Table 2-1

Absolute Maximum Ratings (GND = 0 V)

Rating

Symbol

Value

Unit

Internal supply voltage

VCCI

–0.3 to +2.75

External supply voltage

VCCE

–0.3 to +3.6

Operating temperature range

–40 to +85

°C

Storage temperature

TSTG

–55 to +125

°C

Table 2-2

Thermal Characteristics

Characteristic

Symbol

BGA Value3

Unit

Junction-to-ambient thermal resistance1

RθJA or θJA

TBD

˚C/W

Junction-to-case thermal resistance2

RθJC or θJC

TBD

˚C/W

Thermal characterization parameter

TBD

˚C/W

Notes:

Junction-to-ambient thermal resistance is based on measurements on a horizontal-

single-sided printed circuit board per SEMI G38-87 in natural convection.(SEMI is

Semiconductor Equipment and Materials International, 805 East Middlefield Rd.,

Mountain View, CA 94043, (415) 964-5111)

Junction-to-case thermal resistance is based on measurements using a cold plate per

SEMI G30-88, with the exception that the cold plate temperature is used for the case

temperature.

These are measured values; testing is not complete. Values were measured on a non-

standard four-layer thermal test board (two internal planes) at one watt in a horizontal

configuration.

Freescale Semiconductor, Inc.

For More Information On This Product,

Go to: www.freescale.com

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