MPC5675KFF0VMS2R datasheet(89/147 Pages) NXP

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Electrical characteristics

MPC5675K Microcontroller Data Sheet, Rev. 9

NXP Semiconductors

3.17.3

I/O pad current specifications

The power consumption of an I/O segment is dependent on the usage of the pins on a particular segment. The power

consumption is the sum of all output pin currents for a particular segment. The output pin current can be calculated based on

the voltage, frequency, and load on the pin.

3.17.4

Power Sequence Pin States for GPIO Pads

Medium

—

2.5

—

2.5

—

2.5

—

100

—

2.5

—

200

3Fast

—

1—6

1.5

—

7—

1—6

—

100

1—6

—

200

Symmetric

1—8

—

3—

Pullup/down

(3.6 V max)

—————

7500

——

————

1 The values provided in this table are not applicable for PDI and EBI/DRAM interface.

2 Slope at rising/falling edge.

3 Data based on characterization results, not tested in production.

Table 35. I/O pad current specifications

Pad Type

Load

(pF)

Frequency

(MHz)

VDD_HV_IO

(V)

Current

(mA)

GP Slow/Medium

3.6

0.30

GP Slow/Symmetric

3.6

0.76

GP Slow/Fast

3.6

3.40

GP Slow

0.5

3.6

0.04

Table 36. Power sequence pin states for GPIO pads

VDD_LV_COR

VDD_HV_IO

Pad Function

Low

Outputs Disabled

Low

High

Outputs Disabled

High

Low

Outputs Disabled

Table 34. GP pads AC electrical characteristics1 (continued)

No.

Pad

Tswitchon1

(ns)

Rise/Fall2

(ns)

Frequency

(MHz)

Current slew3

(mA/ns)

Load drive

(pF)

Min

Typ

Max

Min

Typ

Max

Min

Typ

Max

Min

Typ

Max

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