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DSPIC33EP128GS708 bảng dữ liệu(PDF) 462 Page - Microchip Technology

tên linh kiện DSPIC33EP128GS708
Giải thích chi tiết về linh kiện  16-Bit Digital Signal Controllers for Digital Power Applications with Interconnected High-Speed PWM, ADC, PGA and Comparators
PDF  484 Pages
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nhà sản xuất  MICROCHIP [Microchip Technology]
Trang chủ  http://www.microchip.com
Logo MICROCHIP - Microchip Technology

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dsPIC33EPXXXGS70X/80X FAMILY
DS70005258C-page 462
 2016-2018 Microchip Technology Inc.
RECOMMENDED LAND PATTERN
Dimension Limits
Units
C2
Contact Pad Spacing
Contact Pitch
MILLIMETERS
0.50 BSC
MIN
E
MAX
8.40
Contact Pad Length (X48)
Contact Pad Width (X48)
Y1
X1
1.50
0.30
Microchip Technology Drawing C04-2300-PT Rev A
NOM
48-Lead Thin Quad Flatpack (PT) - 7x7x1.0 mm Body [TQFP]
C1
C2
E
X1
Y1
G
C1
Contact Pad Spacing
8.40
Distance Between Pads
G
0.20
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
Notes:
Dimensioning and tolerancing per ASME Y14.5M
For best soldering results, thermal vias, if used, should be filled or tented to avoid solder loss during
reflow process
1.
2.
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Note:
SILK SCREEN
12
48



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