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DSPIC33EP128GS708 bảng dữ liệu(PDF) 461 Page - Microchip Technology

tên linh kiện DSPIC33EP128GS708
Giải thích chi tiết về linh kiện  16-Bit Digital Signal Controllers for Digital Power Applications with Interconnected High-Speed PWM, ADC, PGA and Comparators
PDF  484 Pages
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nhà sản xuất  MICROCHIP [Microchip Technology]
Trang chủ  http://www.microchip.com
Logo MICROCHIP - Microchip Technology

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 2016-2018 Microchip Technology Inc.
DS70005258C-page 461
dsPIC33EPXXXGS70X/80X FAMILY
Microchip Technology Drawing C04-300-PT Rev A Sheet 2 of 2
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Note:
48-Lead Thin Quad Flatpack (PT) - 7x7x1.0 mm Body [TQFP]
H
L
(L1)
c
SECTION A-A
2.
1.
4.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
3.
protrusions shall not exceed 0.25mm per side.
Mold Draft Angle Bottom
Molded Package Thickness
Dimension Limits
Mold Draft Angle Top
Notes:
Foot Length
Lead Width
Lead Thickness
Molded Package Length
Molded Package Width
Overall Length
Overall Width
Foot Angle
Footprint
Standoff
Overall Height
Lead Pitch
Number of Leads
12°
11°
13°
0.75
0.60
0.45
L
12°
0.22
7.00 BSC
7.00 BSC
9.00 BSC
9.00 BSC
3.5°
1.00 REF
c
b
D1
E1
0.09
0.17
11°
D
E
L1
0°
13°
0.27
0.16
-
7°
1.00
0.50 BSC
48
NOM
MILLIMETERS
A1
A2
A
e
0.05
0.95
-
Units
N
MIN
1.05
0.15
1.20
-
-
MAX
Chamfers at corners are optional; size may vary.
Pin 1 visual index feature may vary, but must be located within the hatched area.
Dimensioning and tolerancing per ASME Y14.5M
Dimensions D1 and E1 do not include mold flash or protrusions. Mold flash or
5.
plastic body at datum plane H
Datums A-B and D to be determined at center line between leads where leads exit



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