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DSPIC33EP128GS708 bảng dữ liệu(PDF) 459 Page - Microchip Technology

tên linh kiện DSPIC33EP128GS708
Giải thích chi tiết về linh kiện  16-Bit Digital Signal Controllers for Digital Power Applications with Interconnected High-Speed PWM, ADC, PGA and Comparators
PDF  484 Pages
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nhà sản xuất  MICROCHIP [Microchip Technology]
Trang chủ  http://www.microchip.com
Logo MICROCHIP - Microchip Technology

DSPIC33EP128GS708 bảng dữ liệu(HTML) 459 Page - Microchip Technology

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 2016-2018 Microchip Technology Inc.
DS70005258C-page 459
dsPIC33EPXXXGS70X/80X FAMILY
RECOMMENDED LAND PATTERN
Dimension Limits
Units
C2
Optional Center Pad Width
Contact Pad Spacing
Optional Center Pad Length
Contact Pitch
Y2
X2
6.60
6.60
MILLIMETERS
0.65 BSC
MIN
E
MAX
8.00
Contact Pad Length (X44)
Contact Pad Width (X44)
Y1
X1
0.85
0.35
Microchip Technology Drawing No. C04-2103C
NOM
44-Lead Plastic Quad Flat, No Lead Package (ML) - 8x8 mm Body [QFN or VQFN]
SILK SCREEN
1
2
44
C1
Contact Pad Spacing
8.00
Contact Pad to Contact Pad (X40)
G1
0.30
Thermal Via Diameter
V
Thermal Via Pitch
EV
0.33
1.20
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
Notes:
Dimensioning and tolerancing per ASME Y14.5M
For best soldering results, thermal vias, if used, should be filled or tented to avoid solder loss during
reflow process
1.
2.
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Note:
C1
C2
EV
EV
X2
Y2
E
X1
Y1
Contact Pad to Center Pad (X44)
G2
0.28
G2
ØV
G1



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