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DSPIC33EP128GS708 bảng dữ liệu(PDF) 464 Page - Microchip Technology

tên linh kiện DSPIC33EP128GS708
Giải thích chi tiết về linh kiện  16-Bit Digital Signal Controllers for Digital Power Applications with Interconnected High-Speed PWM, ADC, PGA and Comparators
PDF  484 Pages
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nhà sản xuất  MICROCHIP [Microchip Technology]
Trang chủ  http://www.microchip.com
Logo MICROCHIP - Microchip Technology

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dsPIC33EPXXXGS70X/80X FAMILY
DS70005258C-page 464
 2016-2018 Microchip Technology Inc.
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Note:
64-Lead Plastic Thin Quad Flatpack (PT)-10x10x1 mm Body, 2.00 mm Footprint [TQFP]
13°
12°
11°
Mold Draft Angle Bottom
13°
12°
11°
Mold Draft Angle Top
0.27
0.22
0.17
b
Lead Width
0.20
-
0.09
c
Lead Thickness
10.00 BSC
D1
Molded Package Length
10.00 BSC
E1
Molded Package Width
12.00 BSC
D
Overall Length
12.00 BSC
E
Overall Width
7°
3.5°
0°
Foot Angle
0.75
0.60
0.45
L
Foot Length
0.15
-
0.05
A1
Standoff
1.05
1.00
0.95
A2
Molded Package Thickness
1.20
-
-
A
Overall Height
0.50 BSC
e
Lead Pitch
64
N
Number of Leads
MAX
NOM
MIN
Dimension Limits
MILLIMETERS
Units
Footprint
L1
1.00 REF
2. Chamfers at corners are optional; size may vary.
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
4. Dimensioning and tolerancing per ASME Y14.5M
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
3. Dimensions D1 and E1 do not include mold flash or protrusions. Mold flash or
protrusions shall not exceed 0.25mm per side.
Notes:
Microchip Technology Drawing C04-085C Sheet 2 of 2
L
(L1)
c
H
X
X=A—B OR D
e/2
DETAIL 1
SECTION A-A



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