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MCP19110-E/MJ bảng dữ liệu(PDF) 16 Page - Microchip Technology

tên linh kiện MCP19110-E/MJ
Giải thích chi tiết về linh kiện  Digitally-Enhanced Power Analog Controller
PDF  226 Pages
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nhà sản xuất  MICROCHIP [Microchip Technology]
Trang chủ  http://www.microchip.com
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MCP19110-E/MJ bảng dữ liệu(HTML) 16 Page - Microchip Technology

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MCP19110/11
DS20002331D-page 16
 2013-2016 Microchip Technology Inc.
2.1.22
HDRV PIN
The gate of the high-side MOSFET is connected to
HDRV. This is a floating driver referenced to PHASE.
The PCB trace connecting HDRV to the gate must be
of minimal length and appropriate width to handle the
high-peak drive current and fast voltage transitions.
2.1.23
PHASE PIN
The PHASE pin provides the return path for the high-
side gate driver. The source of the high-side MOSFET,
drain of the low-side MOSFET and the inductor are
connected to this pin.
2.1.24
BOOT PIN
The BOOT pin is the floating bootstrap supply pin for
the high-side gate driver. A capacitor is connected
between this pin and the PHASE pin to provide the
necessary charge to turn on the high-side MOSFET.
2.1.25
+VSEN PIN
The non-inverting input of the unity gain amplifier used
for output voltage remote sensing is connected to the
+VSEN pin. This pin can be internally pulled-up to VDD
by setting PE1<PUEN> bit.
2.1.26
-VSEN PIN
The inverting input of the unity gain amplifier used for
output voltage remote sensing is connected to the
-VSEN pin. This pin can be internally pull-down to GND
by setting PE1<PDEN> bit.
2.1.27
+ISEN PIN
The non-inverting input of the current sense amplifier is
connected to the +ISEN pin.
2.1.28
-ISEN PIN
The inverting input of the current sense amplifier is
connected to the -ISEN pin.
2.1.29
EXPOSED PAD (EP)
There is no internal connection to the Exposed Thermal
Pad. The EP should be connected to the GND pin and
to the GND PCB plane to aid in the removal of the heat.



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