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TMS320DM355 bảng dữ liệu(PDF) 94 Page - Texas Instruments

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tên linh kiện TMS320DM355
Giải thích chi tiết về linh kiện  Digital Media System-on-Chip (DMSoC)
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TMS320DM355 bảng dữ liệu(HTML) 94 Page - Texas Instruments

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TMS320DM355
SPRS463G – SEPTEMBER 2007 – REVISED JUNE 2010
www.ti.com
3.13 Power Management
The DM355 is designed for minimal power consumption. There are two components to power
consumption: active power and leakage power. Active power is the power consumed to perform work and
scales with clock frequency and the amount of computations being performed. Active power can be
reduced by controlling the clocks in such a way as to either operate at a clock setting just high enough to
complete the required operation in the required timeline or to run at a clock setting until the work is
complete and then drastically cut the clocks (e.g. to PLL Bypass mode) until additional work must be
performed. Leakage power is due to static current leakage and occurs regardless of the clock rate.
Leakage, or standby power, is unavoidable while power is applied and scales roughly with the operating
junction temperatures. Leakage power can only be avoided by removing power completely from a device
or subsystem. The DM355 includes several power management features which are briefly described in
Table 3-17. Refer to TMS320DM35x Digital Media System-on-Chip (DMSoC) ARM Subsystem Reference
Guide (literature number SPRUFB3) for more information on power management.
Table 3-27. Power Management Features
Power Management Features
Description
Clock Management
Module clock disable
Module clocks can be disabled to reduce switching power
Module clock frequency scaling
Module clock frequency can be scaled to reduce switching power
PLL power-down
The PLLs can be powered-down when not in use to reduce
switching power
ARM Sleep Mode
ARM Wait-for-Interrupt sleep mode
Disable ARM clock to reduce active power
System Sleep Modes
Deep Sleep mode
Stop all device clocks and power down internal oscillators to reduce
active power to a minimum. Registers and memory are preserved.
I/O Management
USB Phy power-down
The USB Phy can be powered-down to reduce USB I/O power
DAC power-down
The DAC's can be powered-down to reduce DAC power
DDR self-refresh and power down
The DDR / mDDR device can be put into self-refresh and power
down states
94
Detailed Device Description
Copyright © 2007–2010, Texas Instruments Incorporated
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