COP8CCR9IMT7SLASHNOPB datasheet(105/111 Pages) TI1

105 / 111 page

PACKAGE OPTION ADDENDUM

www.ti.com

5-Oct-2015

Addendum-Page 1

PACKAGING INFORMATION

Orderable Device

Status

(1)

Package Type Package

Drawing

Pins Package

Qty

Eco Plan

(2)

Lead/Ball Finish

(6)

MSL Peak Temp

(3)

Op Temp (°C)

Device Marking

(4/5)

Samples

COP8CBR9HVA8/NOPB

OBSOLETE

PLCC

TBD

Call TI

-40 to 85

COP8CBR9HVA8

COP8CBR9IMT8/NOPB

ACTIVE

TSSOP

DGG

Green (RoHS

& no Sb/Br)

CU SN

Level-2-260C-1 YEAR

-40 to 85

COP8CBR9IMT8

COP8CCR9HVA8/NOPB

ACTIVE

PLCC

Green (RoHS

& no Sb/Br)

CU SN

Level-3-245C-168 HR

-40 to 125

COP8CCR9HVA8

COP8CCR9IMT7/NOPB

ACTIVE

TSSOP

DGG

Green (RoHS

& no Sb/Br)

CU SN

Level-2-260C-1 YEAR

-40 to 125

COP8CCR9IMT7

COP8CCR9IMT8/63SN

ACTIVE

TSSOP

DGG

1000

Green (RoHS

& no Sb/Br)

CU SN

Level-2-260C-1 YEAR

COP8CCR9IMT8

COP8CCR9IMT8/NOPB

ACTIVE

TSSOP

DGG

Green (RoHS

& no Sb/Br)

CU SN

Level-2-260C-1 YEAR

-40 to 125

COP8CCR9IMT8

COP8CCR9LVA7/NOPB

OBSOLETE

PLCC

TBD

Call TI

-40 to 125

COP8CCR9LVA7

COP8CDR9HVA8/NOPB

ACTIVE

PLCC

Green (RoHS

& no Sb/Br)

CU SN

Level-3-245C-168 HR

-40 to 85

COP8CDR9HVA8

(1) The marketing status values are defined as follows:

ACTIVE: Product device recommended for new designs.

LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.

NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.

PREVIEW: Device has been announced but is not in production. Samples may or may not be available.

OBSOLETE: TI has discontinued the production of the device.

(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability

information and additional product content details.

TBD: The Pb-Free/Green conversion plan has not been defined.

Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that

lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.

Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between

the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.

Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight

in homogeneous material)

(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.

(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.

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