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AN4043 bảng dữ liệu(PDF) 48 Page - STMicroelectronics

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Giải thích chi tiết về linh kiện  In recent years the variable speed motor control market has required high performance
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AN4043 bảng dữ liệu(HTML) 48 Page - STMicroelectronics

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Power losses and dissipation
AN4043
48/60
Doc ID 022726 Rev 2
More generally, in the case of the device, power is time dependent too. The device
temperature can be calculated by using the convolution integral method applied to
Equation
31Equation 31, as follows:
Equation 32
An alternative method, very useful for the simulator tools, is the transient thermal impedance
model, which provides a simple method to estimate the junction temperature rise under a
transient condition.
By using the thermo-electrical analogy, the transient thermal impedance Zth(t) can be
transformed into an electrical equivalent RC network. The number of RC sections increases
the model details, therefore a twelfth order model, for Zth(j-a), based on the Cauer and Foster
networks, has been used in order to improve the accuracy of both models.
Figure 31 and Figure 32 show the general Cauer and Foster RC equivalent circuit used for
the thermal impedance model.
Figure 31.
Cauer RC equivalent circuit
Figure 32.
Foster RC equivalent circuit
Temperatures inside the electrical RC network represent voltages, power flows represent
currents, electrical resistances and capacitances represent thermal resistances and
capacitances respectively. The case temperature is represented with a DC voltage source
and it can be interpreted as the initial junction temperature.
Transient thermal impedance models are derived by curve fitting an equation to the
measured data. Values for the individual resistors and capacitors are the variables from that
equation and are defined in
Table 11, for both Zth(j-a) Cauer and Foster thermal impedance
models.
τ
τ
⋅
τ
−
=
Δ
∫
d
)
(
P
)
t
(
Z
)
t
(
T
t
0
th
AM11819v1
C1
C2
C3
Cn
R1
R2
R3
Rn
AM11820v1
R1
R2
R3
Rn
C1
C2
C3
Cn



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