AN4043 datasheet(35/60 Pages) STMICROELECTRONICS

35 / 60 page

AN4043

Package

Doc ID 022726 Rev 2

35/60

Package

The NDIP is a dual-in-line transfer mold package available in 26-lead version (NDIP-26L)

able to meet demanding cost and size requirements of consumer appliance inverters. It

consists of a copper lead frame with power stage and control stage soldered on it and

housed using the transfer molding process. The excellent thermal properties of the copper

allows good heat spread and heat transfer, furthermore, the thickness and the layout of the

lead frames has been optimized in order to further reduce the thermal resistance.

The package pinout has been designed in order to maximize the distance between the high

voltage and low voltage pins, by placing the relevant pins on the opposite side of the

package. This is mainly useful to keep a safe distance between high voltage and low voltage

pins and for an easy PCB layout.

Finally, thanks to the transfer molding technology and design optimization, the SLLIMM-

nano offers a high power density level in a very compact package while providing good

thermal propriety, electrical isolation and overall reliable performance.

3.1

Package structure

Figure 23 contains the images and an internal structure illustration of the NDIP-26L

package.

Figure 23.

Images and internal view of NDIP-26L package

Top view

Bottom view

Internal view

x = 29.5 mm

y1 = 12.5 mm (body only)

y2 = 22 mm (including leads)

z1 = 3.1 mm (body only)

z2 = 7 mm (including leads)

Main dimensions

SLL

IMM

-nan

SLLIMM-nano

NDIP-26L

IGBT

FWD

HVIC

AN4043 bảng dữ liệu(PDF) 35 Page - STMicroelectronics