IO13PDB0V0 datasheet(115/197 Pages) MICROSEMI

115 / 197 page

SmartFusion Customizable System-on-Chip (cSoC)

Re vi s i on 12

5 - 1

5 – Pin Descriptions

Supply Pins

Name

Type

Description

GND

Ground Digital ground to the FPGA fabric, microcontroller subsystem and GPIOs

GND15ADC0

Ground Quiet analog ground to the 1.5 V circuitry of the first analog-to-digital converter (ADC)

GND15ADC1

Ground Quiet analog ground to the 1.5 V circuitry of the second ADC

GND15ADC2

Ground Quite analog ground to the 1.5 V circuitry of the third ADC

GND33ADC0

Ground Quiet analog ground to the 3.3 V circuitry of the first ADC

GND33ADC1

Ground Quiet analog ground to the 3.3 V circuitry of the second ADC

GND33ADC2

Ground Quiet analog ground to the 3.3 V circuitry of the third ADC

GNDA

Ground Quiet analog ground to the analog front-end

GNDAQ

Ground Quiet analog ground to the analog I/O of SmartFusion cSoCs

GNDENVM

Ground Digital ground to the embedded nonvolatile memory (eNVM)

GNDLPXTAL

Ground Analog ground to the low power 32 KHz crystal oscillator circuitry

GNDMAINXTAL

Ground Analog ground to the main crystal oscillator circuitry

GNDQ

Ground Quiet digital ground supply voltage to input buffers of I/O banks. Within the package, the

GNDQ plane is decoupled from the simultaneous switching noise originated from the

output buffer ground domain. This minimizes the noise transfer within the package and

improves input signal integrity. GNDQ needs to always be connected on the board to

GND.

GNDRCOSC

Ground Analog ground to the integrated RC oscillator circuit

GNDSDD0

Ground Analog ground to the first sigma-delta DAC

GNDSDD1

Ground Common analog ground to the second and third sigma-delta DACs

GNDTM0

Ground Analog temperature monitor common ground for signal conditioning blocks SCB 0 and

SCB 1 (see information for pins "TM0" and "TM1" in the "Analog Front-End (AFE)"

section on page 5-14).

GNDTM1

Ground Analog temperature monitor common ground for signal conditioning block SCB 2 and

SBCB 3 (see information for pins "TM2" and "TM3" in the "Analog Front-End (AFE)"

section on page 5-14).

GNDTM2

Ground Analog temperature monitor common ground for signal conditioning block SCB4

GNDVAREF

Ground Analog ground reference used by the ADC. This pad should be connected to a quiet

analog ground.

VCC

Supply

Digital supply to the FPGA fabric and MSS, nominally 1.5 V. VCC is also required for

powering the JTAG state machine, in addition to VJTAG. Even when a SmartFusion

cSoC is in bypass mode in a JTAG chain of interconnected devices, both VCC and

VJTAG must remain powered to allow JTAG signals to pass through the SmartFusion

cSoC.

Notes:

1. The following 3.3 V supplies should be connected together while following proper noise filtering practices: VCC33A,

VCC33ADCx, VCC33AP, VCC33SDDx, VCCMAINXTAL, and VCCLPXTAL.

2. The following 1.5 V supplies should be connected together while following proper noise filtering practices: VCC,

VCC15A, and VCC15ADCx.

3. For more details on VCCPLLx capacitor recommendations, refer to the application note AC359, SmartFusion cSoC

Board Design Guidelines, the "PLL Power Supply Decoupling Scheme" section.

IO13PDB0V0 bảng dữ liệu(PDF) 115 Page - Microsemi Corporation

IO13PDB0V0 bảng dữ liệu(HTML) 115 Page - Microsemi Corporation

Html Pages

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57 58 59 60 61 62 63 64 65 66 67 68 69 70 71 72 73 74 75 76 77 78 79 80 81 82 83 84 85 86 87 88 89 90 91 92 93 94 95 96 97 98 99 100 ...More

bảng dữ liệu tải về

Link URL