IO13PDB0V0 datasheet(87/197 Pages) MICROSEMI

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SmartFusion Customizable System-on-Chip (cSoC)

Re vi s i on 12

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Timing Characteristics

Embedded Nonvolatile Memory Block (eNVM)

Electrical Characteristics

Table 2-90 describes the eNVM maximum performance.

Table 2-89 • FIFO

Worst Commercial-Case Conditions: TJ = 85°C, VCC = 1.425 V

Parameter

Description

–1

Std.

Units

tENS

REN, WEN Setup Time

1.40

1.68

tENH

REN, WEN Hold Time

0.02

tBKS

BLK Setup Time

0.19

tBKH

BLK Hold Time

0.00

tDS

Input Data (WD) Setup Time

0.19

0.22

tDH

Input Data (WD) Hold Time

0.00

tCKQ1

Clock High to New Data Valid on RD (flow-through)

2.39

2.87

tCKQ2

Clock High to New Data Valid on RD (pipelined)

0.91

1.09

tRCKEF

RCLK High to Empty Flag Valid

1.74

2.09

tWCKFF

WCLK High to Full Flag Valid

1.66

1.99

tCKAF

Clock HIGH to Almost Empty/Full Flag Valid

6.29

7.54

tRSTFG

RESET Low to Empty/Full Flag Valid

1.72

2.06

tRSTAF

RESET Low to Almost Empty/Full Flag Valid

6.22

7.47

tRSTBQ

RESET Low to Data Out Low on RD (flow-through)

0.94

1.12

RESET Low to Data Out Low on RD (pipelined)

0.94

1.12

tREMRSTB

RESET Removal

0.29

0.35

tRECRSTB

RESET Recovery

1.52

1.83

tMPWRSTB

RESET Minimum Pulse Width

0.22

tCYC

Clock Cycle Time

3.28

FMAX

Maximum Frequency for FIFO

305

MHz

Note:

For specific junction temperature and voltage supply levels, refer to Table 2-7 on page 2-9 for derating values.

Table 2-90 • eNVM Block Timing, Worst Commercial Case Conditions: TJ = 85°C, VCC = 1.425 V

Parameter

Description

A2F060

A2F200

A2F500

Units

–1

Std.

–1

Std.

–1

Std.

tFMAXCLKeNVM Maximum frequency for clock for the control logic – 5

cycles (5:1:1:1*)

MHz

tFMAXCLKeNVM Maximum frequency for clock for the control logic – 6

cycles (6:1:1:1*)

100

MHz

Note:

*6:1:1:1 indicates 6 cycles for the first access and 1 each for the next three accesses. 5:1:1:1 indicates 5 cycles

for the first access and 1 each for the next three accesses.

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