IO13PDB0V0 datasheet(102/197 Pages) MICROSEMI

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SmartFusion DC and Switching Characteristics

2- 90

R e v i sio n 1 2

Inter-Integrated Circuit (I2C) Characteristics

This section describes the DC and switching of the I2C interface. Unless otherwise noted, all output

characteristics given are for a 100 pF load on the pins. For timing parameter definitions, refer to Figure 2-

48 on page 2-91.

Table 2-101 • I2C Characteristics

Commercial Case Conditions: TJ = 85ºC, VDD = 1.425 V, –1 Speed Grade

Parameter

Definition

Condition

Value

Unit

VIL

Minimum input low voltage

–

SeeTable 2-36 on

page 2-30

–

Maximum input low voltage

–

See Table 2-36

–

VIH

Minimum input high voltage

–

See Table 2-36

–

Maximum input high voltage

–

See Table 2-36

–

VOL

Maximum output voltage low

IOL =8mA

See Table 2-36

–

IIL

Input current high

–

See Table 2-36

–

IIH

Input current low

–

See Table 2-36

–

Vhyst

Hysteresis of Schmitt trigger

inputs

–

See Table 2-33 on

page 2-29

TFALL

Fall time 2

VIHmin to VILMax, Cload = 400 pF

15.0

VIHmin to VILMax, Cload = 100 pF

4.0

TRISE

Rise time 2

VILMax to VIHmin, Cload = 400pF

19.5

VILMax to VIHmin, Cload = 100pF

5.2

Cin

Pin capacitance

VIN = 0, f = 1.0 MHz

8.0

Rpull-up

Output buffer maximum pull-

down Resistance 1

–50

Rpull-down

Output buffer maximum pull-up

Resistance 1

–

150

Dmax

Maximum data rate

Fast mode

400

Kbps

tLOW

Low period of I2C_x_SCL 3

–

pclk cycles

tHIGH

High period of I2C_x_SCL 3

–

pclk cycles

tHD;STA

START hold time 3

–

pclk cycles

tSU;STA

START setup time 3

–

pclk cycles

tHD;DAT

DATA hold time 3

–

pclk cycles

tSU;DAT

DATA setup time 3

–

pclk cycles

Notes:

1. These maximum values are provided for information only. Minimum output buffer resistance values depend on

VCCxxxxIOBx, drive strength selection, temperature, and process. For board design considerations and detailed output

buffer resistances, use the corresponding IBIS models located on the SoC Products Group website at

http://www.microsemi.com/index.php?option=com_microsemi&Itemid=489&lang=en&view=salescontact.

2. These values are provided for a load of 100 pF and 400 pF. For board design considerations and detailed output buffer

resistances,

use

the

corresponding

IBIS

models

located

the

SoC

Products

Group

website

http://www.microsemi.com/index.php?option=com_microsemi&Itemid=489&lang=en&view=salescontact.

3. For allowable Pclk configurations, refer to the Inter-Integrated Circuit (I2C) Peripherals section in the SmartFusion

Microcontroller Subsystem User’s Guide.

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