EDJ2104BASE datasheet(5/148 Pages) ELPIDA

5 / 148 page

EDJ2104BASE, EDJ2108BASE

Preliminary Data Sheet E1505E20 (Ver. 2.0)

DDR3 SDRAM Mode Register 3 [MR3] .....................................................................................................80

Burst Length (MR0) ...................................................................................................................................81

Burst Type (MR0) ......................................................................................................................................81

DLL Enable (MR1) .....................................................................................................................................82

DLL-off Mode .............................................................................................................................................82

DLL on/off switching procedure .................................................................................................................83

Additive Latency (MR1)..............................................................................................................................85

Write Leveling (MR1) .................................................................................................................................86

TDQS, /TDQS function (MR1) ...................................................................................................................89

Extended Temperature Usage (MR2) ........................................................................................................90

Multi Purpose Register (MR3)....................................................................................................................92

Operation of the DDR3 SDRAM..................................................................................................................99

Read Timing Definition...............................................................................................................................99

Read Operation .......................................................................................................................................103

Write Timing Definition.............................................................................................................................110

Write Operation........................................................................................................................................111

Write Timing Violations ............................................................................................................................117

Write Data Mask ......................................................................................................................................118

Precharge ................................................................................................................................................119

Auto Precharge Operation .......................................................................................................................120

Auto-Refresh............................................................................................................................................121

Self-Refresh.............................................................................................................................................122

Power-Down Mode ..................................................................................................................................123

Input Clock Frequency Change during Precharge Power-Down..............................................................130

On-Die Termination (ODT).......................................................................................................................131

ZQ Calibration..........................................................................................................................................143

Package Drawing ......................................................................................................................................145

Recommended Soldering Conditions........................................................................................................146

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