TLK6002 datasheet(87/96 Pages) TI

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TLK6002

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SLLSE34 – MAY 2010

Appendix A – Application Board Supply Recommendations

Nominal Board Voltages Required: 1.0V, and either 1.5 or 1.8V

Ground - Connect all device grounds together on the application board (DGND, AGND)

1.0V – Bulk Decoupled

1. Ferrite Bead

→ DVDD (Locally Decoupled)

2. Ferrite Bead

→ AVDD / VDDT / VDDD (Locally Decoupled)

1.5V or 1.8V – Bulk Decoupled

1. Ferrite Bead

→ VDDQA/B (Locally Decoupled)

2. Ferrite Bead

→ VDDRA,VDDRB (Separate, Locally Decoupled)

3. Ferrite Bead

→ VDDO1,VDDO2,VDDO3 (Locally Decoupled)

VREF* can be generated using 1k resistors between VDDQA/B and DGND, and should be locally

decoupled.

Note: Ferrite beads should have high impedance near the fundamental frequency that the parallel data is

running at.

Note: Bulk decoupling prior to the ferrite beads required in order to decouple noise from power source.

This decoupling will be determined by your power source and what frequencies of noise it creates.

Note: For close to device localized decoupling (after ferrite beads), 1.0µF and 0.1µF caps should be

placed on the pins of the device on the back side of the board.

It is strongly recommended that TI review relevant pages of your application board schematics and layout

before fabrication to ensure first pass success.

Appendix A – Application Board Supply Recommendations

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