OMAP3530-HiRel datasheet(98/239 Pages) TI

98 / 239 page

OMAP3525-HiRel and OMAP3530-HiRel Applications Processors

SPRS599 – JUNE 2009

www.ti.com

Table 3-3. Recommended Operating Conditions (continued)

PARAMETER

DESCRIPTION

MIN

NOM

MAX

UNIT

vdds_sram

SRAM LDOs

1.71

1.8

1.89

Noise (peak-peak)

mVpp

vdds_dpll_per

Peripherals DPLLs power supply

1.71

1.8

1.89

Noise (peak-peak)

mVpp

vdds_dpll_dll

Supply voltage for DPLLs I/Os

1.71

1.8

1.89

Noise (peak-peak)

mVpp

vdds_csi2

VDDS for serial camera interface

1.71

1.8

1.89

Noise (peak-peak)

mVpp

vdds_csib

VDDS for serial camera interface

1.71

1.8

1.89

Noise (peak-peak) for a frequency from dc to 10 MHz

mVpp

vdds_sdi

Dedicated VDDS for SDI IO cell

1.71

1.8

1.89

Noise (peak-peak)

mVpp

vdds_dsi

1.8-V analog supply pad for the module

1.71

1.8

1.89

Noise (peak-peak)

For a frequency from 0

mVpp

to 10 MHz

For any frequency > 400

2.5

MHz

vpp(2)

eFuse programming

vss

Ground

vssa_dac

Dedicated ground for DAC

Operating junction temperature(3)

-40

°C

(2)

It is recommended not to connect this pin. It is just used for eFuse programming on package unit.

(3)

For proper device operation, Tj must be within the specified range.

ELECTRICAL CHARACTERISTICS

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