ORSPI4 datasheet(259/263 Pages) LATTICE

259 / 263 page

Lattice Semiconductor

ORCA ORSPI4 Data Sheet

259

ment is made with a water-cooled heat sink pressed against the board to draw most of the heat out of the leads.

Note that

ΘJB is expressed in units of °C/W and that this parameter and the way it is measured are still being dis-

cussed by the JEDEC committee.

FPSC Maximum Junction Temperature

Once the power dissipated by the FPSC has been determined, the maximum junction temperature of the FPSC

can be found. This is needed to determine if speed derating of the device from the 85 °C junction temperature used

in all of the delay tables is needed. Using the maximum ambient temperature, TAmax, and the power dissipated by

the device, Q (expressed in °C), the maximum junction temperature is approximated by:

TJmax = TAmax + (Q •

ΘJA)

Package Thermal Characteristics

The thermal characteristics of the 1036-ball ftSBGA and the 1156-ball fpBGA used for the ORSPI4 are available at

the Thermal Management section of the Lattice Semiconductor web site at www.latticesemi.com.

Heat Sink Vendors for BGA Packages

The estimated worst-case power requirements for the ORSPI4 is in the 8 W to 10 W range. Consequently, for most

applications an external heat sink will be required. Table 88 lists, in alphabetical order, heat sink vendors who

advertise heat sinks aimed at the BGA market.

Table 88. Heat Sink Vendors

Package Parasitics

The electrical performance of an IC package, such as signal quality and noise sensitivity, is directly affected by the

package parasitics.

Figure 102. Package Parasitics

Vendor

Location

Phone

Aavid Thermalloy

Concord, NH

(603) 224-9988

Chip Coolers

Warwick, RI

(800) 227-0254

IERC

Burbank, CA

(818) 842-7277

R-Theta

Buffalo, NY

(800) 388-5428

Sanyo Denki

Torrance, CA

(310) 783-5400

Wakeﬁeld Thermal Solutions

Pelham, NH

(800) 325-1426

PAD N

Board Pads

LSW

LSL

LMW

LML

PAD N + 1

LSW

LSL

Circuit

Pad N+1

Pad N

Package

Pads

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